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Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
Infrared PCBoard Inspection
MICROFOCUS X-RAY 3D/CT SYSTEM VX-9100 The VX-9100 3D X-Ray Inspection Machine is a state-of-the-art industrial microfocus CT system designed for precise quality inspection and non-destructive analysis of electronic components. Its advanced cap
The RTI-7500 is CR Technology's its most progressive inline high-speed vision inspection system to date. The RTI-7500 sets a new industry standard with its advanced color image processing Mega-pixel cameras, exceptional precision, and high-speed insp
Electronics Forum | Wed Oct 25 17:26:38 EDT 2000 | Dave F
George: Crucifixions!!! YES!!! I love crucifixions!!!! [Well I do, providing I�m not the crucifixee that is ] The pomp, ceremony, wailing, grumbling, and brat on the grill. You�ll find little sympathy here. Phil and Wolfgang make good points.
Electronics Forum | Mon Jan 15 14:25:54 EST 2001 | davef
Let me make several points on this issue � POINT 1: Let�s be basic � Soldering and welding are examples of process that the quality types call "special processes". Special process. The results of special processes cannot be verified fully by subs
Industry News | 2018-04-11 20:04:01.0
SMTA Europe announces Session 3 Technical Program on Advanced Test Methods at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Technical Library | 2017-06-22 17:11:53.0
C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “air gaps” such as delamination, cracks, voids, and porosity. This paper presents evaluations performed on various advanced packages/assemblies especially flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. For comparison, representative x-ray images of the assemblies were also gathered to show key defect detection features of the two non-destructive techniques.
Technical Library | 2017-06-15 00:44:19.0
Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively inspecting underfill layers connecting organic interposers sandwiched between two ceramics substrates.First, we inspected the samples with transmission mode of scanning acoustic tomography (SAT) system, an inspection routine usually employed in assembly lines because of its simpler interpretation criteria: flawed region blocks the acoustic wave and appears darker. In this multilayer sample, this approach does not offer the crucial information at which layer of underfill has flaws. To resolve this issue, we use C-Mode Scanning in reflection mode to image layer by layer utilizing ultrasound frequencies from 15MHz to 120MHz. Although the sample is thick and contains at least 5 internal material interfaces, we are able to identify defective underfill layer interfaces.
CX-3500 is use to examine internal solder joints, BGA, IC and other complex components.It adopts the structure of high resolution enhanced screen and sealed microcoking X ray tube combination, through X-ray non-destructive fluoroscopy, real-time obse
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
SMTnet Express, May 19, 2022, Subscribers: 25,528, Companies: 11,568, Users: 27,231 Electronics Manufacturing Technical Articles Non-Destructive Characterization of Mechanically Processed Waste Printed Circuit Boards: X
Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling The oven recipe, which consists
Surface Mount Technology Association (SMTA) | https://www.smta.org/expos/
. KYZEN Corporation MacDermid Alpha Electronics Solutions MicroCare Corporation Nikon Metrology, Inc. Omron Inspection Systems PFC Flexible Circuits Professional Sales Inc PVA RBB Systems Seica Inc
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
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