Industry Directory: open solder voids (23)

Heller Industries Inc.

Heller Industries Inc.

Industry Directory | Manufacturer

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Shuttle Star Technology Co., Ltd.

Industry Directory | Manufacturer

Shuttle Star Technology designs and builds advanced off-line 2.5D&3D x-ray inspection systems for solder joint and final assembly test inspection in SMT&EMS. It uses world-class X-ray techniques with advanced defect detection.

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New SMT Equipment: open solder voids (152)

J-STD-001 Specialist (CIS)- Training and Certification

J-STD-001 Specialist (CIS)- Training and Certification

New Equipment | Education/Training

This program is for experienced solderers seeking an in depth knowledge of the J-STD-001 Document. The course reviews this document and helps students learn how to interpret the criteria. Open and closed book exams are required after each module. Han

EPTAC Corporation

Heller 2043 MK7 SMT Reflow Oven

Heller 2043 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 2043 MK7 SMT Reflow Oven Heating Zones: Top 13 / Bottom 13PCB Width: 50 - 560 mmWeight: 3400 kgDimension: W7224 x D1520 x H1440 mmProduct description: Heller 2043 MK7 SMT Reflow Oven, Heating Zones: Top 13 / Bottom 13, PCB Width: 50 - 560 mm,

Qersa Technology Co.,ltd

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Electronics Forum: open solder voids (1614)

voids

Electronics Forum | Sat Sep 09 08:21:36 EDT 2000 | Sal

guys Currently experienced this problem on a product which had been running satifactorily for a period of time. No process changes were made, The problem was highlighted when after ICT when the boards were loaded in to the stress chamber, after the

BGA open joint

Electronics Forum | Wed Aug 04 20:06:24 EDT 2004 | C.W

Customer returned a brd claim that one of the FPGA is having "cold solder joint". I inspected the the BGA location with X-ray and Ersascope, balls' shape look fine, voids are not detected, perimeter joints show shinny and smooth appearance, i have se

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Used SMT Equipment: open solder voids (41)

SMTmax WP-5500

SMTmax WP-5500

Used SMT Equipment | Soldering - Reflow

This SMTmax WP-5500 Reflow Oven is available for bidding in our upcoming online auction. Bidding opens on 7/9/24 and begins closing on 7/10/24. Click the following link for more information: https://bajabid.com/zelpro-solutions/

Baja Bid

Heller 1808EXL

Heller 1808EXL

Used SMT Equipment | Soldering - Reflow

This machine is included in our upcoming online auction. The bidding opens on September 26 and closes on October 12. Please visit the following website for all the details on this item. http://bajabid.com/online-sealed-bid-auction-featuring-items-

Baja Bid

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Industry News: open solder voids (1034)

SQC in Electronics Manufacturing

Industry News | 2003-06-10 08:16:44.0

The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.

SMTnet

New EMS, Lightspeed Manufacturing, Opens for Business

Industry News | 2003-03-11 08:16:17.0

Lightspeed has already shipped its first product, and has set up production in a new building with up to date facilities and equipment.

SMTnet

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Parts & Supplies: open solder voids (14)

Surface Mount Techniques Solder paste Mixer

Surface Mount Techniques Solder paste Mixer

Parts & Supplies | Solder Paste Mixers

Solder paste Mixer Features: Unique contoured shape, generous appearance and practical, which is made by advanced coating process workmanship. Mixing principle is on the basis of Motor rotation and revolution mode of agitation, no need to defrost

KingFei SMT Tech

Yamaha HEAD SERVO BRD ASSY

Yamaha HEAD SERVO BRD ASSY

Parts & Supplies | Pick and Place/Feeders

KHY-M221A-A0 KGT-M221A-A0 YAMAHA YG12 tank chain gland KHY-M2267-00 YG12 tank chain YS12 towline keel X axis PISCO SP2550 R75 KHY-M2276-S0 YS12 screw X-axis YG12 X-axis screw  YG12F YS12F screw guide KHY-M371R-00 RAIL GUIDE 12P YS24 YS100 Feida pl

Qinyi Electronics Co.,Ltd

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Technical Library: open solder voids (56)

THE EFFECT OF VACUUM REFLOW PROCESSING ON SOLDER JOINT VOIDING AND THERMAL FATIGUE RELIABILITY

Technical Library | 2023-01-17 17:19:44.0

A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.

Heller Industries Inc.

THE LAST WILL AND TESTAMENT OF THE BGA VOID

Technical Library | 2023-01-17 17:22:28.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Heller Industries Inc.

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Videos: open solder voids (159)

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

Videos

  · What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine?    · What problems can be solved by smt vacuum reflow soldering machine?   · What is the basic principle of vacuum reflow machine?   · Ho

Dongguan Intercontinental Technology Co., Ltd.

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

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Training Courses: open solder voids (748)

IPC-6012 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-6012 Specialist (CIS)

The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.

Blackfox Training Institute, LLC

IPC-A-600 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-600 Specialist (CIS)

The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.

Blackfox Training Institute, LLC

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Events Calendar: open solder voids (16)

Webinar: BGA and Area Array Process Defects - Causes & Cures

Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,

Webinar: BGA and Area Array Process Defects - Causes & Cures

Surface Mount Technology Association (SMTA)

San Diego Chapter - Minimizing Voiding in Bottom-Terminating Components

Events Calendar | Wed Mar 08 00:00:00 EST 2017 - Wed Mar 08 00:00:00 EST 2017 | San Diego, California USA

San Diego Chapter - Minimizing Voiding in Bottom-Terminating Components

Surface Mount Technology Association (SMTA)

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Career Center - Jobs: open solder voids (32)

Assembler 2 – IPC 610 – 1st Shift

Career Center | Oldsmar, Florida USA | Engineering,Maintenance,Production

Job Title: Assembler 2 – IPC 610 – 1st Shift Address: 3655 Tampa Rd, Oldsmar FL 34677 Duration: 1 year Pay Rate: $15-$18 Hours: 9/80 schedule Monday – Thursday 6:00AM – 3:30PM, Friday 6:00AM to 2:30PM Job Description: Use microscope to verify

Lockheed Martin Corporation

Senior Assembler

Career Center | Oldsmar, Florida USA | Maintenance,Production

Job Description: • Uses microscope to verify correct part placement and orientation, manually align parts before soldering and perform post re-flow inspection and touch-up. • Able to identify and touch up poor wetted solder joints, solder voids / i

intiGrow

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Career Center - Resumes: open solder voids (14)

Experienced Electronics Manufacutring Engineer

Career Center | Wayland, Michigan USA | Engineering,Maintenance,Research and Development,Technical Support

-Young, energetic, and eager individual ready and willing to learn new skills and exercise my current skill set. -Trained and proficient in the following pieces of equipment: MyData Pick and Place, Dek screen printers, Cyberoptic and Koh Young SPI,

SMT and CCA Manufacturing/Process Engineer

Career Center | Grand Rapids, Michigan USA | Engineering,Maintenance,Management,Production,Research and Development,Technical Support

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Express Newsletter: open solder voids (1004)

SMTnet Express - August 17, 2017

SMTnet Express, August 17, 2017, Subscribers: 30,720, Companies: 10,649, Users: 23,665 The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability Richard Coyle, Richard Popowich, Charmaine Johnson - Nokia Bell

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne

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Partner Websites: open solder voids (8026)

Solder Joint Count - Defect Per Million Operations (DPMO) Report | Unisoft Manufacturing Software |

| https://unisoft-cim.com/view-markup_quoting_solder-joint-count-defect-per-million-operations-dpmo-report.html

. Contact Unisoft for details. Method 1) Create a report of the total Solder Joint Count from the SOLDER JOINT COUNT (DPMO) menu. To use: To generate the Solder Joint Report open the desired PC Board with the Unisoft software

Automatic Solder Paste Mixer SMT Assembly Equipment Tin Cream Mixer For PCB Assembly

KingFei SMT Tech | https://www.smtspare-parts.com/sale-9441243-automatic-solder-paste-mixer-smt-assembly-equipment-tin-cream-mixer-for-pcb-assembly.html

,   simple and easy to maintenance;   4. Not shake when stirring;   5. Adopts the principle of motor revolution and rotation, no noise.   6. No need to open the cover of solder paste tin when stirring

KingFei SMT Tech

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