Industry Directory | Consultant / Service Provider / Distributor / Events Organizer / Manufacturer / Manufacturer's Representative / Other
Packagly is a custom packaging company , who help clients to grow their business .They are also helping them to create mark in the market
Industry Directory | Consultant / Service Provider
Multiple Packages is a one-stop shop for wholesale printed boxes that suit your budget and business needs. We offer a number of options, from basic choices of size and color to custom boxes; embossed, hot-stamped or stylish foilin
ProntoTEST-FIXTURE used by electronics manufacturers will accurately setup your Automatic Test Equipment (ATE), Flying Probe and design your "bed of nails" test fixturing. In minutes Unisoft ProntoTEST-FIXTURE software translates CAD and Bill of Ma
New Equipment | Rework & Repair Services
On the cutting edge of technology, we offer a full line of high tech services to assist contract manufacturer's and product research and developers. Specializing in quick turn around times to help get your product to market on time. Training Serv
Electronics Forum | Tue Jun 06 20:02:55 EDT 2000 | Dave F
Ravi: I agree with travis. What's the issue?
Electronics Forum | Fri Jun 02 19:43:40 EDT 2000 | Ravi Bhat
One of my customers has asked about concerns, comments, ideas about putting 0402 packages on bottom side of the board. The process will be no clean with reflow/reflow. If anybody out there has some experience or concerns please comment. Regards
Used SMT Equipment | Pick and Place/Feeders
Product number: KE - 2010L Products in detail Substrate size: Min: 50 mmx30mm Max: 330mmx250mm Substrate thickness: Min: 0.4 mm Max: 4 mm Element size: 0402 ~ 20 mm square elementor 26.5 X11mm Mount speed: 11000 CPH SMT precision: 0.05 MM Elem
Used SMT Equipment | Screen Printers
DEK Horizon 03i automatic stencil printer Specification ： DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2011-02-17 15:04:54.0
GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #27 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort and Casino in Scottsdale, AZ.
Parts & Supplies | Pick and Place/Feeders
Introduce: Code Size Packaging Bags/case 609 9”×9” 300Pcs 10Bags 606 6”×6” 300Pcs 20Bags 604 4”×4” 1200Pcs 10Bags
Parts & Supplies | Component Packaging
PANASONIC SMT Stick Feeder Standard: Size(mm):350*150*60 Brand: PANASONIC Introduce: Voltage: 110V
Technical Library | 2019-10-16 10:20:25.0
A major goal of the development of advanced packaging technology is to reduce the size, weight, and power consumption of electronics components using state-of-the-art commercial technologies. One of the novel concepts involves the use of all three spatial dimensions when designing and producing new systems. In the past, electronic structures tended to be two dimensional in nature. Generally speaking, individually packaged integrated circuit (IC) dies were interconnected on printed circuit boards. Techniques such as die and package stacking naturally contribute to a reduction of the spatial footprint of any given electronic system design.
Technical Library | 2020-04-14 15:56:32.0
This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.
www.unisoft-cim.com/pcbtest.htm - In minutes the Unisoft ProntoTEST-FIXTURE software translates CAD & BOM files into real reference designators, netlists, X/Y component pin geometries, values, tolerances, part numbers, etc. This data is used by Test
SMT Semi Auto Screen Printer for pcb size 1200 in smt LED production line Product introduction: 1.Using precision guide rail and the import motor to drive the blade seat conversion, printing, and high accuracy. 2.Printing scraper can rotate 45
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Tue Sep 08 00:00:00 EDT 2020 - Tue Sep 08 00:00:00 EDT 2020 | ,
Post – Moore's Law Electronics: From Now until Quantum Computing
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | South Plainfield, New Jersey USA | Engineering
Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh
Career Center | Fremont, California USA | Engineering
Job Description: • Has full ownership of HW design and release including HW specification creation, schematic generation, PCB layout, board bring up, and design verification. • Complete PCB design schematic using Orcad capture. • Complete HW desig
Career Center | Los Gatos, California | Management,Sales/Marketing
Seasoned sales professional skilled in both direct sales and sales management. Recognized for polished communication, negotiation, and problem-solving skills, Excelled in positions where a combination of direct sales and channel sales force developm
Career Center | Duluth, Georgia USA | Management,Sales/Marketing
Over 20 years of experience selling high tech capital equipment for manufacturing. ��Accomplished in territory management, regional sales management, and key account management ��Proficient at managing several projects, coordinating engineering deve
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