Industry Directory | Manufacturer
Laserssel Corporation is a leading provider of laser selective soldering technology supporting global semi-conductor, automotive, consumer, communications, military and industrial segments.
The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,
New Equipment | Test Equipment
The AKM600P is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for wafers or panels up to 600 mm x 600 mm. With time-temperature profiling capa
Electronics Forum | Mon Aug 18 09:28:04 EDT 2008 | eyalg
The following standard is used to determine warpage: "High Temperature Package Warpage Measurement Methodology" JESD22B112
Electronics Forum | Thu Jan 21 15:24:18 EST 1999 | Terry Burnette
| I have received prototype PBGA (256 pins) devices from | Motorola (actual part number = KXPC850ZT50). These parts seemed very warped on the edges. When I put the part on a plain surface, it rocks quite a bit when I press lightly on a corner. I h
Used SMT Equipment | Pick and Place/Feeders
Panasonic AM100 pick and place machine FEATURES ▶Single head (single beam) capable of placing an impressive component array including: 0402mm to 120x90x28mm▶Capable of placing large connectors, odd-shaped components, and advanced packaging types suc
Used SMT Equipment | AOI / Automated Optical Inspection
Hello and thank you for your interest in our Orbotech Symbion S36 AOI For Sale. The system is Year 2006.... Excellent condition !!! Complete with all accessories and manuals. Symbion S36 Plus delivers top-of-the-line Post-Reflow AOI p
Industry News | 2016-09-11 12:12:28.0
SMTA China announces that it presented awards for seven papers at the SMTA China 10th Anniversary Reception, held on Tuesday, August 30, 2016 at Shenzhen Convention & Exhibition Center in conjunction with the NEPCON South China Show.
Industry News | 2017-07-23 20:13:17.0
SMTA announces an expanded program for the final day of the SMTA International Conference, September 17 - 21, 2017 in Rosemont, Illinois. In addition to the Lead-Free Symposium, the technical committee expanded the Thursday program to four concurrent tracks. The three additional tracks will focus on Advanced Packaging Technology, Manufacturing Excellence, and Inspection Technologies.
Technical Library | 2017-07-06 15:50:17.0
Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package warpage was measured and simulated. It was found that the package warpage was sensitive to the thickness of inside chips. A FEM method considering viscoelastic property of mold compound was introduced to simulate package warpage. The CTE mismatch was found contributes to more than 90% of the package warpage value when reflowing at the peak temperature. A method was introduced to measure the warpage threshold, which is the smallest warpage value that may lead to HiP. The results in different atmospheres showed that the warpage threshold was 50μm larger in N2 than that in air, suggesting that under N2 atmosphere the process window for HiP defects was larger than that under air, which agreed with the experiments.
Technical Library | 2019-10-03 14:27:01.0
Knowing how package warpage changes over temperature is a critical variable in order to assemble reliable surface mount attached technology. Component and component or component and board surfaces must stay relatively flat with one another or surface mount defects, such as head-in-pillow, open joints, bridged joints, stretched joints, etc. may occur. Initial package flatness can be affected by numerous aspects of the component manufacturing and design. However, change in shape over temperature is primarily driven by CTE mismatch between the different materials in the package. Thus material CTE is a critical factor in package design. When analyzing or modeling package warpage, one may assume that the package receives heat evenly on all sides, when in production this may not be the case. Thus, in order to understand how temperature uniformity can affect the warpage of a package, a case study of package warpage versus different heating spreads is performed.Packages used in the case study have larger form factors, so that the effect of non-uniformity can be more readily quantified within each package. Small and thin packages are less prone to issues with package temperature variation, due to the ability for the heat to conduct through the package material and make up for uneven sources of heat. Multiple packages and multiple package form factors are measured for warpage via a shadow moiré technique while being heated and cooled through reflow profiles matching real world production conditions. Heating of the package is adjusted to compare an evenly heated package to one that is heated unevenly and has poor temperature uniformity between package surfaces. The warpage is measured dynamically as the package is heated and cooled. Conclusions are drawn as to how the role of uneven temperature spread affects the package warpage.
SMT Off-line AOI Machine ETA-V8 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI machine, SPI inspection
SMT Online AOI Machine ETA-V5000H If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI machine, SPI inspect
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
SMTnet Express, October 3, 2019, Subscribers: 32,260, Companies: 10,890, Users: 25,178 Effects of Temperature Uniformity on Package Warpage Credits: Akrometrix Knowing how package warpage changes over temperature is a critical variable in order
SMTnet Express, July 6, 2017, Subscribers: 30,558, Companies: 10,626, Users: 23,470 Effects of Package Warpage on Head-in-Pillow Defect Zhenyu Zhao, Chuan Chen, Yuming Wang, Lei Liu, Guisheng Zou, Jian Cai and Qian Wang - Tsinghua University
