Leading manufacturer of Packaging, Material Handling and Automated Storage Retreval Systems. Our Returnable Packaging Systems are used in the Electronic, Automotive and General manufacturing industries. Schaefer provides turn-key ESD solutions.
Industry Directory | Consultant / Service Provider / Distributor / Manufacturer
OX3.com provides engineering, processing and wholesaling of packaging required for the storage, transport, or handling of electronic devices and components. These are typically tapes, trays, tubes, totes, reels or other fixtures.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Introducing the ezCLIP universal stop clip for PCB magazine racks. The ezCLIP system was created to allow electronics manufacturers who manually load/unload PCB magazine racks a simple way to distinguish required spacing between boards and to prevent
Electronics Forum | Wed Oct 20 10:41:22 EDT 1999 | Eric Lerz
Our company (assembler and user) has experienced some board problems relating to warpage and solderability. The manner in which they are packaged by our fabricators and stored in our stock prior to assembly has been questioned (as one of many factor
Electronics Forum | Wed Feb 22 08:31:42 EST 2006 | davef
Q1 Are there any standard regulating the subject? Very few infos found on IPC. A1 We�re unaware of standards for packing and storage for most types of boards. * IPC 4553 standard for Immersion Silver Finish, 3.8 Packing and Storage. * J-STD-033 and E
Used SMT Equipment | Soldering - Reflow
Gen5 Waterless Cooling and Flux Separation System – Heated Cooling Module in 1st Cooling Zone for Controlling Cooling Slope – Enhanced Waterless Cooling Modules for Low Product Exit Temperature. Complete Computer Control System including: Flat Panel
Used SMT Equipment | Board Cleaners
Aqueous Technologies Batch Cleaner For Sale. Just came out of United States Air Force Base where it has been kept in storage for many years. The cleaner is clean and the time meter reads only 208 cycles. See attached pictures and information belo
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2013-06-07 15:36:04.0
GPD Global has signed a partnership agreement with Aegis Software to distribute CircuitCAM Express data translation software.
Parts & Supplies | Pick and Place/Feeders
GFC-K01 KME CM402 Feeder Storage Cart GFC-K01 KME CM402 Feeder Storage Cart The feeder storage cart gives your operators a secure place to put unused feeders between set-ups minimizing failures due to improper storage or handling. When its time
Parts & Supplies | Pick and Place/Feeders
GFC-P01 PANASERT MSR Feeder Storage Cart GFC-P01 PANASERT MSR Feeder Storage Cart The feeder storage cart gives your operators a secure place to put unused feeders between set-ups minimizing failures due to improper storage or handling. When its
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
SMT Loader&Unloader for load & unload PCB board magazine storage racks GoldLand Electronic Technology Co., Ltd 88#, Nan Ling Road, Xin Qiao, Sha Jing, Shenzhen 518103, China Tel : +86-13823675048 ? Wechat / WhatsApp ? Skype: sophyluo1985 Email:
Training Courses | ONLINE | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Fri Sep 18 00:00:00 EDT 2020 - Fri Sep 18 00:00:00 EDT 2020 | ,
Defect Detection for Advanced Wafer and Package Devices
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | San Jose, California USA | Engineering,Research and Development
www.srqconsultants.com : for job reqs Type of job background: Design for Test (DFT), with ATE Test development experience, and an IC design generalist. Job Summary Must have +5 years industry experience combination in IC Design and ATE test. Som
Career Center | San Diego, California USA | Engineering,Management,Production
Customer interaction, inventory and delivery of Stencils. In charge of the Satellite Operation in San Diego, Ca. Report to Headquarters in Lake Forest, Ca. Duties and responsibilities: Take full responsibility for the Satellite Operation facility.
Career Center | FARIDABAD, HARYANA India | Engineering,Maintenance,Management,Production,Quality Control
SMT Maintenance ( Samsung Techwin Screen Printers, Solder Paste Inspection, Panasonic & Fuji Chip Mounters & Multi Mounters, Heller Reflow Machines, Functional Testing Inline Machines, Epoxy Dispensors, Underfill Reflow, Routers) Industrial Enginee
Career Center | Mysore, India | Engineering,Production,Quality Control,Technical Support
· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc
SMTnet Express, March 3, 2022, Subscribers: 25,842, Companies: 11,529, Users: 27,083 Component Reliability After Long Term Storage Each year the semiconductor industry routes a significant volume of devices to recycling sites
ORION Industries | http://orionindustries.com/ul.php
, inventory withdrawal, molding, finishing, packaging and shipping. The fabricated parts traceability program creates value for the end-product manufacturer to ensure that the component specifications are not compromised and continue to meet UL requirements
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/w08f-nxt-8mm-feeder-143704?category=1140
> Wholesale of FUJI SMT feeders, CP/XP/XPF/NXT intelligent feeders, W08~W119mm feeders, for CP/XP/XPF/NXT/AIMEX machines. Original new/ Used FUJI NXT 8mm W08F Feeder Inquiry Now Previous Next
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