Easy to Use The A500 is the easiest to use fully automatic SPI system. The user simply loads a Gerber 274-X file for the PCB panel to be inspected, locks down the panel on the board holder and hits the play button. The system takes over from there,
New Equipment | Rework & Repair Equipment
The X-1 Precision SMT/BGA Rework Station is a flexible system designed for manual alignment and placement or removal of BGA, microBGA, Flip Chip, CSP and other surface mount electronic components with precisely controlled solder reflow profiles. The
Electronics Forum | Wed Jun 26 21:05:15 EDT 2002 | ianchan
Hi Dave F, customer calls it "warp", we can call it "twist/bow"..etc. the "warp" occurs on individual PCB cells of 28per each panel. the overall dimension of the panel is 139mm x 168mm, and each individual PCB cell is 2.4mm x 1.2mm. Thickness is 0.
Electronics Forum | Thu Jun 25 13:00:41 EDT 1998 | Bill D.
I have a 2-up panel measuring about 8" x 8" with a score for depanel throuch the middle. I see warping after reflow of the panel (bending in/about score line). The board is not framed (i.e., supported) during SMT reflow other than on the conveyor thr
Used SMT Equipment | Soldering - Selective
Make: Nordson ACE Model: KISS 103ILDP Description: This is Dual Pot Inline selective soldering system, with two selective soldering machines, tied together that can be run independently OR as a single inline selective system. This syste
Used SMT Equipment | SPI / Solder Paste Inspection
CyberOptics SE300 Ultra 3D SPI 3-D Solder Paste Inspection Machine Model: SE300 Ultra Vintage: 2008 Good Functional Condition - Recently Taken Offline Multi-Panel 1-D and 2-D Barcode Read w/ System Sensor Mechanical Board Stop Solution Less th
Industry News | 2016-02-17 16:31:00.0
Akrometrix LLC will exhibit in Booth #1623 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Company representatives will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.
Industry News | 2016-02-18 19:59:51.0
Akrometrix will exhibit at the SMTA Houston & Dallas Expo & Tech Forums in Texas. SMTA Houston is scheduled to take place Tuesday, March 1, 2016 at the Stafford Centre and SMTA Dallas is scheduled to take place Thursday, March 3, 2016 at the Plano Centre. The PAC Global team will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. PAC Global also will demonstrate the new Akrometrix Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.
Parts & Supplies | Chipshooters / Chip Mounters
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Parts & Supplies | Pick and Place/Feeders
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| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_09_16_09.pdf
: Please use a telephone and call: 605-772-3434 Enter access code: 2 Attendee Quick Reference Control Panel Features: Once you have joined our Webinar, you will see this GoToWebinar Control Panel and Grab Tab
Lewis & Clark | https://www.lewis-clark.com/product/nordson-ace-kiss-103-ildp-selective-solder-2015/
Board Warp Compensation Step and repeat capability in both X- and Y-axis for multiple boards in a panel Heated nitrogen to the solder nozzle
