Copper Oxide for Parallel Electronic Plating System (PCB industry). Pan-Continental (H. K.) Limited is the biggest Copper and Zinc compound in Taiwan. Welcome to cooperate with your company.
Eurocoin is Europe's leading supplier to the coin-operated machine industry. Our major product lines are coin and banknote validators, TFT-LCD panels, tokens & gaming chips, touchscreens and spares. We offer pan-European sales and technical support.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Description： P/N Description of Goods Quantity Application SMS-1308 SMT Special Double Splice Tape 8mm for Pan.CM402 3pcs of matt black tape. 500pcs /box For 8mm carrier tape SMS-1312 SMT Special Single Splice Tape 12mm for Pan.CM402 2pcs
Electronics Forum | Mon Oct 13 11:27:51 EDT 2008 | dwelch123
For 15 years I have used a similar method, only I used two bread pans. You can fit alot more solder in them. In one pan I drilled holes very similar to the photo in one pan and used a reclaiming agent such as Kleenox to prep it a bit. Then used the o
Electronics Forum | Wed Oct 07 13:36:11 EDT 2020 | rieko
I tried to reply to your response, but the site locked the discussion? You gave the information on the bread pans. I was wondering a teflon bread loaf pan would work for SAC?
Used SMT Equipment | Flexible Mounters
Product Name: Samsung DECN-S2 chip mounter Product number: Samsung DECN-S2 Detailed product introduction In order to improve production capacity, the transmission path of PCB is optimized. Modular track I believe through the module type track ca
Used SMT Equipment | SMT Equipment
Product Name: Samsung DECN-S2 chip mounter Product number: Samsung DECN-S2 Detailed product introduction In order to improve production capacity, the transmission path of PCB is optimized. Modular track I believe through the module type track ca
Industry News | 2003-03-12 08:28:44.0
CAM350 Release 8 is aimed at allowing engineering and manufacturing groups to detect and fix potential PCB fabrication problems earlier in the process.
Industry News | 2013-01-02 15:53:13.0
The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.
Parts & Supplies | Assembly Accessories
YAMAHA 90990-08J016 SCREW,PAN HEAD FOR YG12 YS12 YS100 YS24 YSM10 YSM20，YS MAINTENANCE PARTS M2×L2.5 More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com , thanks.
Parts & Supplies | SMT Equipment
KHY-M7108-00 COLLAR,BRG. 10 KHY-M7111-00 HOLDER,BEARING 10 KHY-M7112-00 PLATE 1,BRG. 10 KHY-M7115-00 BRACKET,JOINT 10 KHY-M7115-01 BRACKET,JOINT 10 KHY-M7116-00 SPRING,RETURN 10 KHY-M711A-00 PIN,POST 10 KHY-M7121-00 PULLEY,SHAFT 10 KH
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2018-02-28 22:28:30.0
Circuit functional density requirements continue to drive innovative approaches to high performance packaging. Some new approaches include; aggressive space reduction, embedded solutions, and those that offer some form of risk reduction and rework potential are now options that are being explored by customers. Requirements for assembly of these types of packages necessitate the deposition of solder paste and assembly of components into cavities of the substrates to gain z-axis density as well as area functional density. Advances in the fabrication of PWB’s with cavities using newly developed laser micro-fabrication processes along with increased circuit pitch density of 50 micron lines and spaces permit new applications for high performance electronic substrates. First published at SMTA Pan Pacific Symposium
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
Events Calendar | Mon Feb 10 00:00:00 EST 2020 - Thu Feb 13 00:00:00 EST 2020 | The Big Island of Hawaii, Hawaii USA
Pan Pacific Microelectronics Symposium
Events Calendar | Mon Jan 30 00:00:00 EST 2023 - Thu Feb 02 00:00:00 EST 2023 | Kauai, Hawaii USA
Pan Pacific Microelectronics Symposium
Career Center | Silvassa, India | Production,Quality Control,Sales/Marketing
Experience in Electronics manufacturing line including SMT Processes
Career Center | GURGAON, India | Engineering,Quality Control,Research and Development
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