Electronics Forum: pasta (20)

SOLDER BALLS

Electronics Forum | Mon May 04 02:39:31 EDT 2009 | lococost

Have you contacted Cobar? They should have a sample of your batches of pasta they could analyse.

Re: SMT-Paddesign

Electronics Forum | Tue Mar 31 12:54:53 EST 1998 | Justin Medernach

| | Can someyone tell me where i can find some informations, | | about optimal design of footpad for pasta dispensing. | John, | Check out IPC-SM-782. This refers to surface mount pad design for surface mounted components. The spec is available fo

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Industry News: pasta (2)

Assembly Challenges of Small Packages - A Tech Symposium Presented by Industry Experts

Industry News | 2015-09-01 15:13:52.0

Please join BEST for our 2015 Tech Symposium on the Assembly Challenges of Small Packages. Increase your understanding of the challenges involved in small footprint device assembly.

BEST Inc.

Mixed process of SMT reflow oven

Industry News | 2018-10-18 08:53:06.0

Mixed process of SMT reflow oven

Flason Electronic Co.,limited

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