Industry Directory: paste balls (10)

Max Top Company

Industry Directory |

Solder Wire, Solder Bar, Solder Paste, Solder Ball

Shenzhen Kewei Industries

Industry Directory | Manufacturer

Kewei Tin Industry Company, established in 2006, located in Shenzhen mainly focus on Solder Products R&D, provide solder wire/solder bar/solder paste/tin anode/tin balls/soldering flux etc...

New SMT Equipment: paste balls (61)

APR Solder Paste Dipping Plate

APR Solder Paste Dipping Plate

New Equipment | Solder Paste Stencils

These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t

BEST Inc.

Solder Paste Dipping Plate

Solder Paste Dipping Plate

New Equipment | Solder Paste Stencils

These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t

BEST Inc.

Electronics Forum: paste balls (1073)

SAC solder balls reflow with Sn/Pb paste - Voids Issue

Electronics Forum | Wed Oct 04 14:14:49 EDT 2006 | russ

Change mfgrs of paste OR better yet use pbfree paste, If you are collapsing the balls on the BGA then you are possibly overheating the paste/flux quite a bit. most lead pastes do not like much more than 230 C. I am assuming that you have a decent p

SAC solder balls reflow with Sn/Pb paste - Voids Issue

Electronics Forum | Wed Oct 04 14:48:49 EDT 2006 | cw

My soak at 150C - 180C for approx. 85sec to 100sec. I believe this is sufficient. I can't change my paste because customer wants to use SnPb paste with SAC solder balls. They claimed that they have sucessful result with other CM. I need to know if

Used SMT Equipment: paste balls (15)

DEK Horizon 03i Printer

DEK Horizon 03i Printer

Used SMT Equipment | Screen Printers

DEK Horizon 03i automatic stencil printer Specification : DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha YV100XG YAMAHAmulti-functional chip mounter

Yamaha YV100XG YAMAHAmulti-functional chip mounter

Used SMT Equipment | Chipshooters / Chip Mounters

Product name: YV100XG YAMAHAmulti-functional chip mounter Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHAYV100XG High speed and high precisionmulti-function modular placement machine 0.18 seconds/CHIP ultra-high-s

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: paste balls (256)

Parts & Supplies: paste balls (28)

Yamaha YAMAHA YV100XG

Yamaha YAMAHA YV100XG

Parts & Supplies | Assembly Accessories

Product name: YV100XG YAMAHAmulti-functional chip mounter Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHAYV100XG High speed and high precisionmulti-function modular placement machine 0.18 seconds/CHIP ul

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Fuji BALL SCREW GGPH2760

Fuji BALL SCREW GGPH2760

Parts & Supplies | Chipshooters / Chip Mounters

FUJI BALL SCREW GGPH2760 700402      SCREW M3X8 CSK.SLTD.M/C ST.ST 700145      SCREW M4X25 CAP HD ST.ST 700118      SCREW M5X25 CAP HD ST.ST 700113      SCREW M4X20 CAP HD ST.ST 700101      SCREW M3X8 CAP HD ST.ST 171321      RETAINER^DIAPH^^3

Qinyi Electronics Co.,Ltd

Technical Library: paste balls (22)

BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages

Technical Library | 2007-02-01 09:57:15.0

The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture.

BEST Inc.

Selective Solder Paste Deposition Reliability Test Results.

Technical Library | 2007-06-21 17:03:16.0

The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture (...) While there have been several studies comparing these two attachment methods, this study highlights the effect of rework technique on the electrical characteristics and reliability of reworked BGAs.

BEST Inc.

Videos: paste balls (44)

3D SPI manufacturer

3D SPI manufacturer

Videos

Inline 3D SPI, Standard Automatic solder paste inspection system As one of the strongest SMT 3D SPI Manufacuturer in China, we provide you all the different models of online solder paste inspection machine,we have variety of size and models of the

CNSMT CO.LTD

I.C.T Lyra Series Reflow Oven with CBS Function

I.C.T Lyra Series Reflow Oven with CBS Function

Videos

Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board

Dongguan Intercontinental Technology Co., Ltd.

Training Courses: paste balls (5)

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: paste balls (5)

Solder Paste Qualification Testing - SMTA Webinar

Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,

Solder Paste Qualification Testing - SMTA Webinar

Surface Mount Technology Association (SMTA)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Career Center - Jobs: paste balls (2)

Chemical Scale-Up Engineer

Career Center | South Plainfield, New Jersey USA | Engineering

Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh

MacDermid Alpha Electronics Solutions

Packaging Engineer

Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support

SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic

Texas Instruments

Career Center - Resumes: paste balls (5)

resume_srini_chada

Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support

• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a

Project Manager - Electronics Products

Career Center | , | Engineering,Production

Project Management, SMT Process Engineering

Express Newsletter: paste balls (700)

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne

Partner Websites: paste balls (119)

Solder Paste and Flux Frequently Asked Questions | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-faqs

! This will contaminate the unused paste and degrade its performance. Process and Inspection I’m getting solder balls on the sides of my chip components

ASYMTEK Products | Nordson Electronics Solutions

Solder Ball Defects - Heller

Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects/

Solder Ball Defects - Heller Home » Solder Ball Defects Re-printed in partnership with  ITM Solder Ball Defects Defect: solder balls Solder balls are very small fines of solder that have separated from the main body that forms the joint

Heller Industries Inc.


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