1785-L11B 1785-L20B 1785-L20C15 1785-L20E 1785-L26B 1785-L30B 1785-L40B 1785-L40C15 1785-L40E 1785-L40L 1785-L46B 1785-L46C15 1785-L60B 1785-L60L 1785-L80B 1785-L80C15 1785-L80E 1785-L86B 1785-M100 1785-ME16 1785-ME32 1785-ME64
170AAI03000 170AAI14000 171CCC98030 171CCS70000 171CCS70010 171CCS76000 171CCS78000 172JNN21032 172PNN21022 172PNN26022 174CEV20030 174CEV30010 170AAI52040 170AAO12000 170AAO92100 170ADI34000 170ADI350
Electronics Forum | Wed Mar 21 13:47:16 EDT 2012 | jax
To have an Operating Temp (Tool Classification) within your range, you might want to try. PB85 (Pb85/Sb10/Sn5) SMT is normally processed using Vapor Phase but can also be achieved with Nitrogen assisted Convection Reflow depending on size and compl
Electronics Forum | Mon Dec 28 08:51:45 EST 2009 | jax
What solder are you talking about and what reflow method are you using? High Melt Alloys: SN96 (Sn96/Ag4 or Sn96.5/Ag3.5) - Simliar to SAC305 although normally uses Rosin based flux that can required more extensive cleaning. Pb85 (Pb85/Sb10/Sn5) -
Used SMT Equipment | Screen Printers
Speedline Technologies MPM UP1500 Solder Paste Screen Printer 10/31/2001, 230VAC Accupro 8.6.3 L to R Board flow, SMEMA, Light Tower, Edge Clamp Board Foils, 29x29 stencil size, Under Stencil Cleaner, Single stage conveyor, Solder Paste Dispense,
Used SMT Equipment | SMT Equipment
Many Fuji Sparr parts for sales.. No Part No. Description Qty. Machine 1 GPH4580 HOLDER 7 CP43 2 MPH0472 PISTON 19 CP43 3 GPL1200 PIN 8 CP43 4 S1046A CIR-CLIP WR19 10 CP43 5 PPQ1020 PIN,LOCATING 1 CP43 6 GXT2333 HOLDER,PIN 2 CP43 7 MPA5031 COLLAR 2 C
Industry News | 2011-01-20 13:45:14.0
IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.
Industry News | 2010-09-28 22:38:14.0
Count On Tools Inc., a leading provider of precision components and SMT spare parts, announces the release of MYDATA Replacement ZFF 250 Pre-Filters (OEM Part Number K-011-0051) for the full range of MYDATA SMT pick-and-place systems. The replacement pre-filters provide savings up to 30 percent over original MYDATA pre-filters, making production more affordable.
Parts & Supplies | SMT Equipment
USE ALTENATIVE PART FUJI RELAY G2R-212S-VNUS DC12V > USE ALTENATIVE PART FUJI RELAY G2R-112S-DC24V TO R2016A > USE ALTENATIVE FUJI RELAY G2R-212S-DC24V TO R2017A > USE ALTENATIVE FUJI RELAY G3R-102SLN DC24V/2A FUJI
Parts & Supplies | SMT Equipment
USE ALTENATIVE PART FUJI RELAY G2R-212S-VNUS DC12V > USE ALTENATIVE PART FUJI RELAY G2R-112S-DC24V TO R2016A > USE ALTENATIVE FUJI RELAY G2R-212S-DC24V TO R2017A > USE ALTENATIVE FUJI RELAY G3R-102SLN DC24V/2A FUJI
Technical Library | 2014-05-22 17:10:37.0
In this paper, the general solution model of Chou has been used to predict the integral enthalpies of mixing of liquid In-Sn-Zn ternary alloys in five selected sections, xIn/xSn = 0.15/0.85, 0.34/0.66, 0.50/0.50, 0.67/0.33 and 0.85/0.15. The other traditional models such as Kohler, Muggianu, Toop and Hillert are also included in calculations. Comparison with literature data was done and showed reasonable agreement with Toop and Hillert asymmetric models.
Technical Library | 2023-02-13 18:56:42.0
This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85_C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.
Quick Overview: The ADS- 3530 is ideal for electronic assemblers looking for an easy and affordable way to improve soldering speed and consistency. Dramatically more efficient and reliable than hand soldering or manual dipping, the ADS-3530 features
Quick Overview: The ADS- 3530 is ideal for electronic assemblers looking for an easy and affordable way to improve soldering speed and consistency. Dramatically more efficient and reliable than hand soldering or manual dipping, the ADS-3530 features
Alternative Pb-Free Alloys Alternative Pb-Free Alloys While SnAgCu (SAC) alloys still dominate Pb-free selection in North America, especially Sn3.0Ag0.5Cu (SAC305), there are alternative material systems available. Any OEM that is concerned about
SMTnet Express, May 22, 2014, Subscribers: 22782, Members: Companies: 13894, Users: 36234 Pb-free solders: Comparison of different geometrical models in calculating of enthalpy of mixing of In-Sn-Zn ternary system. A. Boulouiz, M. El Moudane, M
