Industry Directory | Distributor / Manufacturer / Manufacturer's Representative / Standards Setting / Certification / Training Provider
PB Technik supplies SMT equipment and materials to the Polish market. JUKI ERSA EKRA BRADY MARANTZ
Industry Directory | Distributor
Ditributor for Solder Products of Indium Corporation of America. Solder Paste, Pb and Pb free, Flux, Solder Wire, Solder bar, Preforms,Thermal Interface and Solar material and,Engineering solders etc
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
New Equipment | Solder Materials
NC Paste Flux is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM NC Paste Flux may be used for general touch up or rework of printed circuit boards, and for attach
Electronics Forum | Thu Jan 05 17:06:38 EST 2006 | russ
Is it now acceptable to discard the SAC alloy directly into the trash or is it still a requirement to dispose of through hazmat procedures. Seems to me that we can now just chuck the old paste right into the normal trash since it is the replacement
Electronics Forum | Wed Feb 16 12:34:49 EST 2005 | greg
Hi all We recently have a problem with component in package 0805 (capasitor 100nF). I have noticed that after reflow soldering only one lead of the component is soldered. The second one is just laying on the PCB land. We use screen printing process
Used SMT Equipment | Chipshooters / Chip Mounters
Samsung chip mounter SM-421 Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to □22mm IC part through On-The-Fly reco
Used SMT Equipment | Chipshooters / Chip Mounters
Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to 22mm IC part through On-The-Fly recognition. It also allows recognition of parts with
Industry News | 2005-09-19 16:07:56.0
No higher temperature and No process changes needed
Industry News | 2018-02-19 13:55:53.0
IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.
Technical Library | 2022-10-31 17:09:04.0
The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.
Technical Library | 2012-10-04 18:52:43.0
First published in the 2012 IPC APEX EXPO technical conference proceedings... Due to the obsolescence of SnPb BGA components, electronics manufacturers that use SnPb solder paste either have to use lead-free BGAs and adjust the reflow process or re-ball t
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Poplar Grove, Illinois | Engineering,Production,Quality Control,Technical Support
Please see resume.
SMTnet Express, November 19, 2015, Subscribers: 23,763, Members: Companies: 14,760, Users: 39,366 HALT Testing of Backward Soldered BGAs on a Military Product B. Gumpert, B. Fox, L. Woody; Lockheed Martin Corporation The move to lead free (Pb-free
SMTnet Express, January 8, 2015, Subscribers: 23,708, Members: Companies: 14,158 , Users: 37,476 The Effect of Pb Mixing Levels on Solder Joint Reliability and Failure Mode of Backward Compatible, High Density Ball Grid Array Assemblies Richard
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/land-patterns-for-leadfree-componet-soldering_topic612_post2167.html
: 20 Mar 2012 Location: Oxfordshire, UK Status: Offline Points: 576 Post Options Post Reply Quote jameshead Report Post Thanks(1) Quote Reply Posted: 26 Oct 2012 at 1:23am Ignoring solder paste aperture size and just looking at the copper pad alone I don't think that rounded rectangles are any better or worse then a normal rectangle for lead-free solder then leaded
