New Equipment | Industrial Automation
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Electronics Forum | Tue Aug 14 13:54:57 EDT 2018 | etmpalletguy
Vlad, Reduce your aperture opening in the stencil, this will give the stencil a good seal around the specific area of concern. In a wave solder environment, solder balling top or bottom surfaces in a wave pallet is caused by excessive flux burning o
Electronics Forum | Tue May 26 11:13:49 EDT 2009 | xinxi
Is the components on the top or on the bottom of the pcb? Have you checked whether the temperature on pcb are too high when it pass through SW that it exceeds the limit that the components can take? Do check with the component manufacture for the te
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