New SMT Equipment: peaks paste (6)

NC273LT Solder Paste For Bismuth Bearing Alloys

NC273LT Solder Paste For Bismuth Bearing Alloys

New Equipment | Solder Materials

AIM's NC273LT solder paste formula with bismuth containing alloys can provide an assembler with an innovative solution when temperature sensitivity is paramount. The revolutionary activator system in AIM's new NC273LT low temperature solder paste im

AIM Solder

ePaste Lead-Free Solder Paste

ePaste Lead-Free Solder Paste

New Equipment | Solder Materials

With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a

Nihon Superior Co., Ltd.

Electronics Forum: peaks paste (338)

Solder paste height

Electronics Forum | Thu Mar 05 09:54:59 EST 2009 | davef

When you measure "solder paste heigth of 7 & 8 mils using a 5.0 mils stencil," are you measuring the top of a flat brick? Sometimes if you snap-off the stencil too fast, the paste touching the stencil walls form peaks along the edge of the brick that

AIM SN100C Solder paste

Electronics Forum | Thu Apr 06 15:47:09 EDT 2006 | jbrower

Last week I had the opportunity to get a sample of AIM SN100C solder paste. The SN100C paste was very nice to work with. My initial observations was that the paste had a very light odor, much less than the Alpha UP78 paste that we are currently

Used SMT Equipment: peaks paste (1)

Cyberoptics SE600 ULTRA 3D SPi

Cyberoptics SE600 ULTRA 3D SPi

Used SMT Equipment | Solderability Testers

CyberOptics SE600 ULTRA 3D SPi Solder Paste Inspection Year 2014. Good working conditions. Dual projector system for the highest accuracy. Factory support and registration included for the buyer at no cost. The SE600 brings together best accu

2nd Machines

Industry News: peaks paste (98)

Easier Dispensing for Thermal Sealant

Industry News | 2003-02-24 09:32:24.0

Now available with an easy-to-use dispensing gun, Electrolube TCR is a single-component, highly thermally conductive RTV sealant.

SMTnet

Circuit World 'continues to outperform majority of printed circuit industry'

Industry News | 2003-02-25 09:31:32.0

Toronto-based Circuit World Corporation (CCW) today announced its fourth quarter and audited year-end results to December 31, 2002.

SMTnet

Parts & Supplies: peaks paste (1)

Rehm Rehm V8 3.2 Nitro

Rehm Rehm V8 3.2 Nitro

Parts & Supplies | Soldering - Reflow

Manufacturer: Rehm Typer: V8 Nitro 3.8 Vintage: 2002 Serial number: 1009 Condition and equipment We have this unit as backup machine, haven't used for a while. 7 zones (5 pre-heat, 2 peak + cooling zone) Transport rail refurbish

OXYGEN SMD Kft.

Technical Library: peaks paste (7)

HALT Testing of Backward Soldered BGAs on a Military Product

Technical Library | 2015-11-19 18:15:07.0

The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.

Lockheed Martin Corporation

Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World

Technical Library | 2009-04-30 18:06:24.0

This presentation surveys the most significant via and via-related laminate failure mechanisms from past to present using data from current induced thermal cycling (CITC) testing, failure analysis, and other sources. The relative life and failure modes of thru vias, buried vias, and microvias (stacked vs. non-stacked) are compared, along with the affect of structure, materials, and peak temperatures on the above. The origin of via-induced laminate failures such as "eyebrow cracks" and Pb free related internal delamination is also explored.

i3 Electronics

Videos: peaks paste (5)

I.C.T Lyra Series Reflow Oven with CBS Function

I.C.T Lyra Series Reflow Oven with CBS Function

Videos

Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board

Dongguan Intercontinental Technology Co., Ltd.

?Panasonic NPM-D3 Modular SMT Placement

?Panasonic NPM-D3 Modular SMT Placement

Videos

​Panasonic NPM-D3 Modular SMT Placement If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine, P

Dongguan Intercontinental Technology Co., Ltd.

Career Center - Jobs: peaks paste (1)

Cad/Laser Tech

Career Center | Lumberton, New Jersey USA | Engineering

Reports to:  Cad/Laser Manager Department:  Cad Location:  Lumberton Phone:  609-261-2670  Ask for Greg Starrett Email:  Send resume as a word document or PDF to greg@metassocs.com Job Summary: Under the general supervision of the Cad Manager

MET Stencil

Express Newsletter: peaks paste (659)


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