New SMT Equipment: pin to hole ratio (3)

DP80C51 - Pipelined High Performance Microcontroller 10 times faster to 8051

New Equipment | Other

Overview • 10 times faster compared to standard 8051 • Interface for additional Special Function Registers • Pipelined RISC architecture The DP80C51 is an ultra high performance, speed optimized soft core, of a single-chip 8-bit embedded controll

Digital Core Design

HS-420C In-Line Axial and Sequence Integration Machine

HS-420C In-Line Axial and Sequence Integration Machine

New Equipment | Through-Hole

HS-420C series is a high-speed, high-accuracy, and high-powered machine, is a new generation axial and sequence integration machine developed independently by Hexi, combined the functions of axial inserting machine and sequence machine. This machine

Hexi Electronic Equipment Co.,Ltd

Electronics Forum: pin to hole ratio (62)

Pin to Hole ratio

Electronics Forum | Wed Jul 20 13:28:02 EDT 2005 | Theo Doucakis

I am looking for some guidance on the proper pin to hole ratio for waved pins. Theo

Pin to Hole ratio

Electronics Forum | Thu Jul 21 22:14:34 EDT 2005 | Ken

Anyone else disagree with IPC-2222 for min-lead to max hole in the application of ribbon lead connector styles?

Industry News: pin to hole ratio (43)

Noncontact Switching Comes to Confined Spaces

Industry News | 2003-03-26 08:25:40.0

The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.

SMTnet

IPC Releases Revision A to IPC-2222 Design Standard

Industry News | 2010-12-17 01:47:04.0

IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.

Association Connecting Electronics Industries (IPC)

Technical Library: pin to hole ratio (2)

Effective Methods to Get Volatile Compounds Out of Reflow Process

Technical Library | 2016-02-11 18:26:43.0

Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free soldering not only operation temperatures increased, but also the chemistry of the solder paste was modified to meet the higher thermal requirements. Miniaturization is a second factor that impacts the reflow process. The density on the assembly is increasing where solder paste deposit volumes decreases due to smaller pad and component dimensions. Pick and place machines can handle more components and to meet this high through put some SMD lines are equipped with dual lane conveyors, doubling solder paste consumption. With the introduction of pin in paste to solder through hole components contamination of the oven increased due to dripping of the paste.

Vitronics Soltec

Techniques for Selective Soldering High Thermal Mass and Fine-Pitch Components

Technical Library | 2022-08-08 15:06:06.0

Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.

Hentec Industries, Inc. (RPS Automation)

Videos: pin to hole ratio (4)

Example of how to import raw GERBER files and convert them to useful production data. Create real reference designators, theta rotation, part numbers, X/Y component pin and center geometries, values, tolerances, etc.

Example of how to import raw GERBER files and convert them to useful production data. Create real reference designators, theta rotation, part numbers, X/Y component pin and center geometries, values, tolerances, etc.

Videos

ProntoGERBER-CONNECTION software is used by electronic manufacturer & imports raw Gerber data & allows the user to add intelligent information to the shapes on the display and creates real reference designators, theta rotation, part numbers, X/Y comp

UNISOFT Corporation

Example of how to import CAD data and BOM files, and export to an assembly machine program set up file.

Example of how to import CAD data and BOM files, and export to an assembly machine program set up file.

Videos

www.unisoft-cim.com/pcbplace.htm - The ProntoPLACE module from Unisoft is used by electronics manufacturers to generate the necessary programs for automatic PCB assembly machines in minutes. ProntoPLACE programs most popular surface mount (SMT) place

UNISOFT Corporation

Express Newsletter: pin to hole ratio (415)

Partner Websites: pin to hole ratio (1577)

N510057078AA Panasonic Mounter NPM 3 - Hole Gas Pipe Connector Coupler

KingFei SMT Tech | https://www.smtspare-parts.com/sale-40300883-n510057078aa-panasonic-mounter-npm-3-hole-gas-pipe-connector-coupler.html

N510057078AA Panasonic Mounter NPM 3 - Hole Gas Pipe Connector Coupler Leave a Message We will call you back soon! Your message must be between 20-3,000 characters

KingFei SMT Tech

PCB Selective Soldering Machine Programming Software ( flux / solder files) Thru-hole THD | Unisoft

| https://unisoft-cim.com/solder.php

. Locate any component, pin or part number, finds shorts between traces, netlist, paperless hyperlinked schematic linked to the asssembly, add annotation notes and graphics


pin to hole ratio searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t t t t t t t t net
  1 2 3 4 5 6 7 8 9 10 Next