New Equipment | Selective Soldering
The Vitronics Soltec mySelective 6747 selective soldering automation workcell is ideal for soldering tall bottom side components, delivers great results as an alternative for pin-in-paste, and is perfect for safeguarding temperature-sensitive compone
Inline x-ray inspection system for combined 3D and transmission x-ray analysis of double-sided boards with high package density. Universal standard system based on the MatriX X2.5 AXI system motion concept with 360º angle shot coverage. A new 3D reco
Electronics Forum | Mon Feb 26 19:56:24 EST 2001 | davef
SMTnet Archives used to have copious amounts of information on a pin-in-hole [e.g., pin-in-paste, paste-in-hole, etc] reflow process, but much of that appears lost with the conversion to the new and improved site format. In getting started, check:
Electronics Forum | Wed Jun 26 15:34:09 EDT 2002 | Daan Terstegge
It does work, but you must keep in mind that not only the stencil must be designed for it, but also the board. Trying to use the pin-in-paste process for a connector with an ordinary wave-solder layout will result in lots of touch-up. You'll need sma
Industry News | 2003-03-13 08:19:18.0
The Flakafix 2.54mm grid IDC board-to-cable connector can now be supplied with a variety of terminations including surface mount, solder-in, press-fit and pin-in-paste.
Industry News | 2018-10-18 10:13:08.0
The Application of the Pin-in-Paste Reflow Process
Technical Library | 2007-09-27 16:18:15.0
Considerable interest exists in the process known as the pinin- paste, or the Alternative Assembly and Reflow Technology (AART) process. The AART process allows for the simultaneous reflow of both odd-form and through hole devices as well as surface mount components. This process has several advantages over the typical mixed technology process sequence that includes wave soldering and/or hand soldering, often in addition to reflow soldering.
Technical Library | 2008-03-18 12:36:31.0
This paper examines the construction of a notebook mainboard with more than 2000 components and no wave soldering required. The board contains standard SMD, chipset BGAs, connectors, through hole components and odd forms placed using full automation and soldered after two reflow cycles under critical process parameters. However, state of the art technology does not help if the process parameters are not set carefully. Can all complex BGAs, THTs and even screws be soldered on a single stencil? What will help us overcome bridging, insufficient solder and thombstoning issues? This paper will demonstrate the placement of all odd shape components using pin-in-paste stencil design and full completion of the motherboard after two reflow cycles.
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Semi-automated, programmable X-ray inspection system with multi-axis for prototyping, failure analysis, manufacturing process validation and rework verification for PCBs up to 18 x 20". The XT-3 is a high quality high-resolution manual x-ray inspecti
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