Manufacturer and Designer of magnetics -- specifically planar magnetics.
Industry Directory | Distributor
Power supply transformers, AC DC converter adaptors, electrical plugs, Planar XF, computer active crossover networks for switching power, switch mode transformer, flyback, audio transformer, high and low voltage current converters and inverters suppl
Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi
Electronics Forum | Wed Apr 12 11:06:05 EDT 2006 | pavel_murtishev
Good afternoon, I'm very sorry for commercial post, but... We are seeking for supplier of used equipment for planar technological process (equipment for producing of microelectronic chips) in the US. Please let me know if you know anyone. Thanks in
Electronics Forum | Wed May 16 02:59:53 EDT 2007 | pavel_murtishev
Good morning, What kind of placement equipment do you use? Many of placement machines have co-planarity check sensors. Switch them on. BR, Pavel
Used SMT Equipment | AOI / Automated Optical Inspection
Mirtec AOI MV-7XI FIVE CAMERA 2D/3D In-Line AOI System Exclusive OMNI-VISION® 2D/3D Inspection Technology Exclusive FIFTEEN MEGA PIXEL ISIS® Vision System 10 Micron / Precision TELECENTRIC COMPOUND LENS Advanced 3D DIGITAL MULTI-FREQUENCY
Used SMT Equipment | Pick and Place/Feeders
Mirtec AOI MV-7omni Description In-Line AOI Machine FIVE CAMERA 2D/3D In-Line AOI System Exclusive OMNI-VISION® 2D/3D Inspection Technology Exclusive FIFTEEN MEGA PIXEL ISIS® Vision System 10 Micron / Precision TELECENTRIC COMPOUND LENS Advanced 3D
Industry News | 2003-01-24 09:07:53.0
For Industrial, Telecom and Datacom Use
Industry News | 2003-03-24 09:46:41.0
Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.
Technical Library | 2021-06-21 19:34:02.0
In this era of electronics miniaturization, high yield and low-cost integrated circuit (IC) substrates play a crucial role by providing a reliable method of high density interconnection of chip to board. In order to maximize substrate real-estate, the distance between Cu traces also known as line and space (L/S) should be minimized. Typical PCB technology consists of L/S larger than 40 µ whereas more advanced wafer level technology currently sits at or around 2 µm L/S. In the past decade, the chip size has decreased significantly along with the L/S on the substrate. The decreasing chip scales and smaller L/S distances has created unique challenges for both printed circuit board (PCB) industry and the semiconductor industry. Fan-out panel-level packaging (FOPLP) is a new manufacturing technology that seeks to bring the PCB world and IC/semiconductor world even closer. While FOPLP is still an emerging technology, the amount of high-volume production in this market space provide a financial incentive to develop innovative solutions in order to enable its ramp up. The most important performance aspect of the fine line plating in this market space is plating uniformity or planarity. Plating uniformity, trace/via top planarity, which measures how flat the top of the traces and vias are a few major features. This is especially important in multilayer processing, as nonuniformity on a lower layer can be transferred to successive layers, disrupting the device design with catastrophic consequences such as short circuits. Additionally, a non-planar surface could also result in signal transmission loss by distortion of the connecting points, like vias and traces. Therefore, plating solutions that provide a uniform, planar profile without any special post treatment are quite desirable.
Technical Library | 1999-05-06 13:38:45.0
This paper traces the key steps that led to the invention of the integrated circuit (IC). The first part of this paper reviews the steady improvements in the performance and fabrication of single transistors in the decade after the Bell Labs breakthrough work in 1947. It sketches the various developments needed to produce a practical IC. In addition, the more advanced processes such as diffusion, oxide masking, photolithography, and epitaxy, which culminated in the planar process, are summarized.
Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.
Link:https://www.ascen.ltd/Products/mask_making_machine/ Automatic medical face mask making production machine to produce the finished face mask ,and to weld face mask by ultrasonic .From material feeding for produce face mask blank to welding the ea
SMTnet Express, May 21, 2015, Subscribers: 22,770, Members: Companies: 14,358, Users: 38,224 Reliability of Embedded Planar Capacitors under Temperature and Voltage Stress Mohammed A. Alam, Michael H. Azarian, Michael Osterman and Michael Pecht
