New SMT Equipment: plating and shadow (37)

PCB Rework and Repair Training

New Equipment | Education/Training

This two day course is based on the IPC-7721. Students will learn how to repair surface mount pads, BGA pads, finger contacts, traces, laminate, plated through holes and more.  Students will be introduced to the proper techniques for SMT & PTH compon

Precision PCB Services, Inc

BGA Rework Machine for soldering and desoldering.  Hot Air BGA rework station for printed circuit board repair.

BGA Rework Machine for soldering and desoldering. Hot Air BGA rework station for printed circuit board repair.

New Equipment | Rework & Repair Equipment

BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla

Precision PCB Services, Inc

Electronics Forum: plating and shadow (157)

Green coating and through-hole plating

Electronics Forum | Tue Aug 11 15:13:05 EDT 1998 | Xingsheng

Hi, can you please tell me how to make green coating and through-hole plating of PCB? Thanks! Xingsheng

Palladium Nickel and Palladium Cobalt plating

Electronics Forum | Tue May 14 22:09:04 EDT 2013 | ultimatejoker

Hi, what is significant different between PdNi and PdCo Plating? I found in some papers indicate that the deposit characteristics for both plating is totally the same.

Used SMT Equipment: plating and shadow (7)

Yamaha YSM10 Pick and Place Machine

Used SMT Equipment | Pick and Place/Feeders

Applicable PCB L510 x W460mm to L50 x W50mm Note: Available in lengths up to L610mm as an option Applicable components03015 to W55 x L100mm (For parts sizes larger the width 45mm, recognition of parts is divided into sections.), Height 15mm or

QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd

Vi Technology 3D SPI

Vi Technology 3D SPI

Used SMT Equipment | SPI / Solder Paste Inspection

Make: VI Technologies Model: 3D Solder Paste Inspection Vintage: 2009 Details: 1. FAHP (flying absolute height profilometry) measurement method 2. Dual light source and on the fly image scan 3. High power M/H light 3D sensor 4. Shadow free ins

Lewis & Clark

Industry News: plating and shadow (135)

Nashua and Parlex Announce Strategic Development Agreement

Industry News | 2003-03-11 08:28:59.0

To cooperate in the development of flexible circuit technology incorporating proprietary printing and plating technologies.

SMTnet

Online PCB Auction – October 7 – 14, 2014 Hosted By GoIndustry & Baja Bid (Featuring Items From Cirtech Electronics).

Industry News | 2014-10-01 15:59:00.0

PCB provider Cirtech Electronics located in Cape Town, South Africa will be liquidating their assets utilizing the online auction services of GoIndustry and Baja Bid. Bidding for the auction will open promptly at 8:00am PDT on October 7th, 2014 and will begin closing at 6:00am PDT on October 14th, 2014.

Baja Bid

Parts & Supplies: plating and shadow (169)

Samsung The wire and connector for CP20CV

Samsung The wire and connector for CP20CV

Parts & Supplies | Pick and Place/Feeders

J1301023    E-RING J1301151    HEX NUT J1301154    FLAT WASHER J1301155    STEEL BALL J1301157    FLAT HEAD CAP SCREW J1301161    FLAT HEAD CAP SCREW J1301164    BEARING J1301266    HEX NUT J1301448    FLAT HEAD CAP SCREW J2500009    STEEL B

QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd

Yamaha CL8MM~88MM feeder parts and accessories

Yamaha CL8MM~88MM feeder parts and accessories

Parts & Supplies | Pick and Place/Feeders

YAMAHA CL8MM~88MM feeder parts and accessories Supply copy new feeder parts for YAMAHA CL type Part Name:MULTI CYLINDER PART No:KW1-M1185-00X Part Name:MAIN ARM PART No:KW1-M1177-00X Part Name:HOLD ARM PART No:KW1-M115L-000 Part Name:INDE

ZK Electronic Technology Co., Limited

Technical Library: plating and shadow (19)

On Oreology, the fracture and flow of "milk's favorite cookie® "

Technical Library | 2024-08-29 18:30:46.0

The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study

1st Place Machinery Inc.

Projection Moiré vs. Shadow Moiré for Warpage Measurement and Failure Analysis of Advanced Packages

Technical Library | 2013-01-31 18:43:15.0

There are three key industry trends that are driving the need for temperature-dependent warpage measurement: the trend toward finer-pitch devices, the emergence of lead-free processing, and changes in device form factors. Warpage measurement has become a key measurement for analysis; prevention and prediction of interconnect defects and has been employed in failure analysis labs and production sites worldwide. First published in the 2012 IPC APEX EXPO technical conference proceedings

ZN Technologies

Videos: plating and shadow (73)

PCB turn conveyor|PCB diverter|90°Turn Conveyor

PCB turn conveyor|PCB diverter|90°Turn Conveyor

Videos

PCB 90°turning conveyor and PCB turn diverter/PCB conveyor machine link: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/95.html PCB 90°Turn conveyor is designed for changing the conveying direction of flow of a PCB production li

ASCEN Technology

turn conveyor|PCB turning conveyor|PCB diverter

turn conveyor|PCB turning conveyor|PCB diverter

Videos

PCB 90°turning conveyor and PCB turn diverter/PCB conveyor machine link: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/95.html PCB 90°Turn conveyor is designed for changing the conveying direction of flow of a PCB production li

ASCEN Technology

Training Courses: plating and shadow (6)

Virtual Course: PCB Design for Implementing 3D and High Density Semiconductor Package Technologies

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

Surface Mount Technology Association (SMTA)

IPC-A-600 Acceptability of Printed Boards Training and Certification Program

Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)

The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.

PIEK International Education Centre

Events Calendar: plating and shadow (3)

Webinar: BGA and Area Array Process Defects - Causes & Cures

Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,

Webinar: BGA and Area Array Process Defects - Causes & Cures

Surface Mount Technology Association (SMTA)

Qualification and Reliability of Microvias

Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,

Qualification and Reliability of Microvias

CALCE Center for Advanced Life Cycle Engineering

Career Center - Jobs: plating and shadow (1)

Sales and Marketing Representatives

Career Center | Dana Point, California USA | Sales/Marketing

We are currently seeking sales reps nationwide for this rapidly growing supplier of printed circuit boards (since 1986)with facilities in southern CA and eight PCB facilities in China and Taiwan, all ISO 9002 certified and UL94V-0 approved, some are

Global Communications

Express Newsletter: plating and shadow (158)

Partner Websites: plating and shadow (323)

Wire-Bonding Reliability of Electroless Ni/Pd/Au Plating - Influence of Electroless Pd Deposition Re

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5495

:  The influence of the electroless deposition of Pd in electroless Ni-P/electroless Pd/immersion Au (ENEPIG) plating was investigated on the reliability of Au and Cu wire-bonding

Surface Mount Technology Association (SMTA)

Dispense Flow and Control Optimized

GPD Global | https://www.gpd-global.com/co_website/pdf/pump/S-Type-Nozzles.pdf

Dispense Flow and Control Optimized Optimize Flow & Control S Type Nozzles Precision Dispensing Systems Headquarters 611 Hollingsworth Street, Grand Junction, CO 81505 USA • T: +1.970.245.0408 • F: +1.970.245.9674 www.gpd-global.com • request@gpd-global.com GPD Global (Asia Pacific

GPD Global


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