Schoch Equipment is a global provider of surface mount assembly and thru hole technology production equipment.
Industry Directory | Consultant / Service Provider
Asset valuation, turnaround management, liquidations.
DynaGen engineers had one clear design goal for our new Vigilant Series: �Find that precise point at which the highest possible quality and the most needed features would combine to provide the lowest overall installed cost. Reliable, Straightforwar
Electronics Forum | Fri Sep 07 12:19:20 EDT 2007 | guqing
We are having problem to develop lead-free (SAC305) reflow profile for big SMT electrolytic caps. The delta T of the joint of the cap with the rest of the board is too big to fit in the tighter lead-free window. Any suggestions regarding the total pr
Electronics Forum | Fri Jun 20 14:08:14 EDT 2008 | wavemasterlarry
LISTEN this is quite a soar subject to me.i have old wounds too from these capacitators and argued with the darn engineers at my old place of employment that if they only stuck to wave and through � hoel stuff, they wouldn�t be in this pickle. IF the
Used SMT Equipment | Soldering - Wave
The machine is too big for our purposes. We currently utilize a much smaller wave machine, as our manufacturing operation is mainly SMT. This machine was using leaded alloys. The last time it was operational it was in normal working order. The pot is
Industry News | 2017-04-24 19:04:48.0
This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.
Industry News | 2019-12-11 16:04:23.0
SMTA announced that the program is finalized for the 25th Annual Pan Pacific Microelectronics Symposium. The event will take place February 10-13, 2020 at the Westin Hapuna Beach Resort on the Big Island of Hawaii. The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.
Parts & Supplies | Pick and Place/Feeders
Many companies first applied SMT second-hand placement machines, and the selected placement machines were relatively stable, with low failure rate, easy maintenance, and important maintenance costs. Therefore, there are still many concerns about buyi
Parts & Supplies | Pick and Place/Feeders
Many companies first applied SMT second-hand placement machines, and the selected placement machines were relatively stable, with low failure rate, easy maintenance, and important maintenance costs. Therefore, there are still many concerns about buyi
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
BESTEMP reflow checker 6 channel temperature profiler Reflow soldering temperature tester Characteristic: 1..High efficiency, data can be stored up to 16 times continuously, and can be downloard to computer for group data viewing. 2. Modular analys
Events Calendar | Tue May 12 00:00:00 EDT 2020 - Tue May 12 00:00:00 EDT 2020 | ,
12 Essential Skills Every Engineer Needs To Learn Part 1
Career Center | , south | Management,Production,Purchasing,Technical Support
Growing CEM needs experienced program manager, or person ready to move up into the role. I have know the execs and management for years. They are great folks to work for. Nice place to live, big town or country living. Not far from Memphis or Hun
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_yageo-0603-resistor-solder-patterns_topic2613.xml
– L pad length = 0.90, W pad width =0.80 and S pad gap = 0.80Our conclusion: The Yageo Toe is too big for today’s assembly Potential for tombstoning The IPC Side is too big, but
AATEC Ltd | https://aatec.ch/md-tape-n-reel-mb872.php
cylinder from the bottom Part (too high) detector / Empty pocket detector / End of tape detector – Pitch position detector User-friendly software PLC/ HMI Controller touch screen Display Adjustable parameters
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