Electronics Forum | Tue Nov 10 13:31:00 EST 2009 | chris0595
When applying the ECCOBOND E3503-1 thermal adhesive to attach a HB-LED to the slug area of a MCPCB, should the OSP coating on the slug area first be removed? I have heard that OSP coatings have poor adhesion properties so I'm wondering how to do this
Electronics Forum | Thu Jul 10 09:55:47 EDT 2003 | davef
A reading of the pictures is: A1: Looks like pad [B1] is smaller than the other pads. It�s weird that the pads are such different colors. A2: Looks like pad [B1] is smaller than the other pads. Solder mask opening [B1] is misregistered and seems s
Industry News | 2003-07-02 08:54:26.0
A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.
Industry News | 2008-10-25 22:05:53.0
ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dr. Harald Wack (Session Chair) of Zestron Corporation, Jason Keeping of Celestica, Barry Richie of Dow Corning Corporation, Phil Kinner of Humiseal, and Lamar Young of Specialty Coating Systems will present in Session 5 on Conformal Coating Adhesion. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.
Parts & Supplies | Pick and Place/Feeders
Smt JUKI Feeder CTF8*2mm Feeder CTF05HP 0402 E1002706CB used in pick and place machine JUKI SMT Mounter feeder / feeder / feeding gun / Feeder / Stick Feeder / Stack Stick Feeder: Part Number Description E3003706AB0 AF12FS JUKI FEEDER 40081758 C
Parts & Supplies | Pick and Place/Feeders
Smt JUKI Feeder CTF0201mm CTF03HP E1001706CB0 used in pick and place machine JUKI SMT Mounter feeder / feeder / feeding gun / Feeder / Stick Feeder / Stack Stick Feeder: Part Number Description E3003706AB0 AF12FS JUKI FEEDER 40081758 CF03HPR 8mm
Technical Library | 2021-11-03 17:05:39.0
Additively printed circuits provide advantages in reduced waste, rapid prototyping, and versatile flexible substrate choices relative to conventional circuit printing. Copper (Cu) based inks along with intense pulsed light (IPL) sintering can be used in additive circuit printing. However, IPL sintered Cu typically suffer from poor solderability due to high roughness and porosity. To address this, hybrid Cu ink which consists of Cu precursor/nanoparticle was formulated to seed Cu species and fill voids in the sintered structure. Nickel (Ni) electroplating was utilized to further improve surface solderability. Simulations were performed at various electroplating conditions and Cu cathode surface roughness using the multi-physics finite element method. By utilizing a mask during IPL sintering, conductivity was induced in exposed regions; this was utilized to achieve selective Ni-electroplating. Surface morphology and cross section analysis of the electrodes were observed through scanning electron microscopy and a 3D optical profilometer. Energy dispersive X-ray spectroscopy analysis was conducted to investigate changes in surface compositions. ASTM D3359 adhesion testing was performed to examine the adhesion between the electrode and substrate. Solder-electrode shear tests were investigated with a tensile tester to observe the shear strength between solder and electrodes. By utilizing Cu precursors and novel multifaceted approach of IPL sintering, a robust and solderable Ni electroplated conductive Cu printed electrode was achieved.
SMT Express, Issue No. 1 - from SMTnet.com Volume 1, Issue No. 1 Thursday, June 3, 1999 Tricks of the Trade Optimizing Time/Pressure Dispensing ofAdhesives by Chrys Shea Return to Previous Page Over the past
