High-volume chipshooting operators with lower cost per placement, reduced machine maintenance, machine downtime and superior ppm performance. Main Features and benefits: Chipshooting at the smallest footprint Faster, smarter, easier, that counts for
Electronics Forum | Sun Apr 18 00:26:29 EDT 1999 | Vic Lau
| | | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | | | I consider "fines" individual unmelted metal sph
Electronics Forum | Sat Apr 17 12:00:12 EDT 1999 | John W
| | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | I consider "fines" individual unmelted metal spheres t
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2018-10-18 08:55:30.0
Nitrogen Protection Reflow Oven
Pick & Place for large PCB. Max PCB 36" x 60". Dual Nozzle, Laser Align, On the fly. Custom build, Windows 7 OS
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