| http://etasmt.com/cc?ID=te_news_bulletin,23574&url=_print
. (Some practitioners pre-bake components and boards to drive out moisture. This is not encouraged and should be a last resort as baking tends to build intermetallics as well as degrade the solderability by increasing oxidation levels
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/products/bonding-and-soldering-systems/c-tack
. ACFs are widely used to perform LCD-to-flex, flex-to-board or flex-to-flex connections. The ACF Laminating/Pre-Tacking process forms the first part of the total bonding process
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