Electronics Forum | Fri Jun 18 06:54:43 EDT 1999 | Paul McMichael
A user of one of our components exceeded the floor life of some plastic BGA components. They did do a pre-bake prior to SMT reflow but only 72 hrs at 40C and not the recommended 12 hours at 125C. I've recommended accoustic microscopy to look for popc
Electronics Forum | Fri Jun 18 13:30:01 EDT 1999 | John Thorup
| A user of one of our components exceeded the floor life of some plastic BGA components. They did do a pre-bake prior to SMT reflow but only 72 hrs at 40C and not the recommended 12 hours at 125C. I've recommended accoustic microscopy to look for po
(Flex) BGA Using a Polyimide Tape Substrate Trent
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
: An Exercise in Technically Sound Cost Reduction Bruce M. Misner Abstract 29-3 Evaluation of Reworkable Edge Bond and Corner Bond Adhesives for BGA Applications Fei Xie, Han Wu, Kelley Hodge, Swapan K
| http://www.szhonreal.com/uploadfile/Download/202305231109343783.pdf
㎜ CN Lead Long CN BGA FBGA Big QFP □50 RS-1 component range 0402 Conventional machine*2 component range □74 Component density A dvanced functionality 0201*2 ～ 74 ㎜、 50×150 ㎜ 0402 ～ □33.5
