New Equipment | Rework & Repair Equipment
RS-300Q set for SMD/BGA rework Integrated device: HOT-AIR station, quartz preheater and control computer 3 zone quartz preheater Preheater of A3 size Power of lower preheater: 3.4kW Power of upper preheater: 500W Smooth temperature adjustment
New Equipment | Rework & Repair Equipment
Full automatic BGA rework station WDS-750 all motherboard repair machine for iphone PS4 repairing WDS BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone, xbox360,ps3,etc. The main u
Electronics Forum | Sun Feb 03 08:44:25 EST 2002 | davef
There is no standard for baking an assembled board prior to BGA rework, nor should there be. The amount of time required to bake a board varies with: * Board material. * Board construction and layers. * Board size. * Components on the board. If som
Electronics Forum | Thu Jan 31 13:19:28 EST 2002 | dason_c
What is the baking time/temperature standard for the PCBA before BGA rework?
Industry News | 2013-04-03 18:46:12.0
IPC – Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2014 IPC APEX EXPO® at the Mandalay Bay Resort and Convention Center in Las Vegas.
Industry News | 2020-03-08 16:23:52.0
IPC invites engineers, researchers, academics, technical experts and industry leaders to submit technical conference abstracts and course proposals for IPC APEX EXPO 2021 to be held at the San Diego Convention Center. Professional development courses will be held January 23-28, and the technical conference will take place January 26-28, 2021.
Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si
Contact Joy Rong for details and price list WhatsApp/wechat/Skype?+86 18779975930 Email: joyrongzhuomao@outlook.com Email: info@seamarkxray.com Web: www.seamarkxray.com Features: Automatic component recognition - Automated parameter setting and co
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
SMTnet Express, January 4, 2018, Subscribers: 31,139, Companies: 10,838, Users: 24,240 IPC-1782 Standard for Traceability Supporting Counterfeit Components Michael Ford; Mentor Graphics Traceability has grown from being a specialized need
