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Industry Directory | Manufacturer
We are world leaders in the Selective Soldering industry, dedicated to developing pioneering technologies, such as our patented 1.5mm Micro Nozzle, to reflect and match the needs of an everchanging manufacturing marketplace.
Industry Directory | Manufacturer
Manufacturer of Fluid Dispensing Equipment for Selective Conformal Coating, Potting, Encasulation & Underfill including Inspection, Conveying and Curing. Total Solution Fluid Dispensing & Conformal Cocating Process Lines.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
New Equipment | Wave Soldering
Peak series soldering machine shows superiority in performance, stability, reliability, safety, operability and maintainability. Aims to reduce customer operational cost (especially reduced the solder dross and oxidation significantly) and improves s
Electronics Forum | Tue Feb 14 10:25:04 EST 2017 | swag
Pre-heat, pre-heat, pre-heat! Swap out your acetylene with some propane. Problem solved. Throw a potato in your solder pot while your at it...
Electronics Forum | Tue Jun 20 22:52:46 EDT 2000 | gary
How to calculate the delta T ? What's the allowable range for delta T value? we r not calculating this in our process, instead we r maintaining the pre-heat temp which we measure from topside of the bd. Thanks in advance
Used SMT Equipment | Soldering - Selective
Vintage: 2010 Details: • Dual Solder Pot (Lead and Lead-Free) • Windows XP Operating System • Top Side Pre Heat • Bottom Side Pre Heat • Spray Fluxer • Includes Step down transformer • Includes (2) 8MM Nozzles Condition: Complete
Used SMT Equipment | SMT Equipment
Make: ERSA Model: Ecoselect 350 Description; Dual pot Lead Free Selective solder machine Vintage: 2006 Configured with: • Bottom side pre heat (IR) • N2 ready Condition: Complete and operational. Available for inspection prior to shipment.
Industry News | 2020-03-25 11:55:11.0
The Surface Mount Technology Association (SMTA) announced the recent release of Selective Soldering 101, the latest in a series of online training courses on the fundamentals of electronics assembly. The course will be useful for equipment operators, technicians, and engineers new to the industry that want to understand more about the soldering process and who have a basic familiarity with the equipment.
Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
Parts & Supplies | Soldering - Reflow
Manufacturer: Rehm Typer: V8 Nitro 3.8 Vintage: 2002 Serial number: 1009 Condition and equipment We have this unit as backup machine, haven't used for a while. 7 zones (5 pre-heat, 2 peak + cooling zone) Transport rail refurbish
Technical Library | 2016-01-12 11:01:25.0
More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT256 has been successfully used with solder paste for LGA assembly. Solder joint encapsulant is used in in-line LGA soldering process with enhanced reliability. It eliminates the underfilling process and provides excellent reworkability. The shear st rength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. Bottom IC of POP has been studied for further understanding of LGA assembly process parameters. All details such as assembly process, drop test and thermal cycling test will be discussed in this paper.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
In-line or stand-alone fluxer/pre-heater This compact modular in-line system utilises the same design concept as the new generation Synchrodex soldering cell and offers the user significantly reduced process time when compared to using a single sold
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization
GPD Global | https://www.gpd-global.com/co_website/heatConfigurations-max2.php
& Fill Dispensing Heated Applications Ensure Uniform Heat Transfer and Dispense Effective Heated Applications Pre-Heat, Work Area Heat, and Post-Heat Pre-heat, work area heat, and post-heat can be
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes
Processes DIMA Products Corporate | Global Directory | Languages Division Only All of Nordson Processes Hot Bar Reflow Soldering Systems Hot Bar Reflow Soldering is a selective soldering process where two pre-fluxed, solder coated parts are heated with a heating element
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