Industry Directory: pressures (96)

Heller Industries Inc.

Heller Industries Inc.

Industry Directory | Manufacturer

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Heller Thermal Systems

Heller Thermal Systems

Industry Directory | Manufacturer

Heller Thermal Systems India location featuring reflow soldering ovens and pressure curing ovens.

New SMT Equipment: pressures (678)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

Time Pressure Liquid Dispensing Pump with Foot Switch or Dry Contact

Time Pressure Liquid Dispensing Pump with Foot Switch or Dry Contact

New Equipment | Dispensing

Time Pressure Liquid Dispensing Pump with Foot switch / Dry contact A great addition to Fully Automatic Dispensing System Time pressure is a versatile method of dispensing that functions across a wide range of viscosities. This dispensing method wo

GPD Global

Electronics Forum: pressures (1175)

DEK HORIZON 265 Squeege Pressure question

Electronics Forum | Mon Nov 11 21:19:06 EST 2019 | dekhead

Knead pressure, is normally at or slightly lower (maybe 25%) than print pressure...

DEK HORIZON 265 Squeege Pressure question

Electronics Forum | Thu Aug 27 03:19:21 EDT 2020 | dekhead

Have you done Squeegee Heights calibration? (no tools required) Does it complete cal routine without error? Does pressure compensate on next print, with corresponding squeegee, following acknowledgement of pressure error? The readings calibration, ge

Used SMT Equipment: pressures (401)

Vitronics Delta 5

Vitronics Delta 5

Used SMT Equipment | Soldering - Wave

This machine will be coming available for purchase. Our end-user customer does not have a set price for this item. They have told us to forward them all offers. Please contact ashlin@bajabid.com for more information. Features: Version V4.6

Baja Bid

Ersa Versaflow 3/45

Ersa Versaflow 3/45

Used SMT Equipment | Soldering - Selective

This machine will be coming available for purchase soon. Our end-user customer does not have a set price for this item. They have told us to forward them all offers. Please contact ashlin@bajabid.com for more information. Features: Version

Baja Bid

Industry News: pressures (943)

Heller Industries Will Feature the MK7 Reflow Oven Featured at IPC APEX 2022 Booth #1920

Industry News | 2021-11-08 14:38:39.0

Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.

Heller Industries Inc.

Frost & Sullivan Award Highlights Heller Industries' Achievements in Global SMT Reflow Soldering Equipment Market

Industry News | 2013-05-21 22:12:09.0

Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.

Heller Industries Inc.

Parts & Supplies: pressures (2143)

Technical Library: pressures (43)

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Technical Library | 2023-01-17 17:12:33.0

Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.

Heller Industries Inc.

ICT-T550 Revolutionizes SMT PCB Coating in Industry 4.0

Technical Library | 2023-11-22 09:17:49.0

In the dynamic realm of Industry 4.0, I.C.T introduces the I.C.T-T550 SMT PCB coating machine, a pioneering addition designed to meet the evolving needs of modern manufacturing. This advanced equipment is equipped with features that not only boost productivity but also prioritize precise and consistent coating quality. Let's delve into the crucial attributes that establish the I.C.T-T550 as a vital component in your production process. 1. Automated Precision for Coating Consistency The I.C.T-T550 PCB Coating Machine integrates an automated pressure regulation system for both dispensing valve and pressure tank, equipped with precision regulators and digital gauges. This ensures a consistent coating process, optimizing precision. 2. Front-End Accessibility for Operational Efficiency Located at the front end, power supply and air pressure adjustments are easily accessible, streamlining control. This user-friendly design enhances operator workflow efficiency. 3. Durable Material Transport The open-material transport rail undergoes hardening treatment and utilizes a specialized stainless steel chain drive, ensuring both longevity and reliable material transport. 4. Track Width Adjustment for Trouble-Free Operation Track width adjustment is achieved through a synchronous belt drive mechanism, ensuring prolonged and trouble-free operation. 5. CNC Machined Frame for Unparalleled Precision The machine's frame, subjected to CNC machining, features an independent, all-steel gantry frame, ensuring the parallel alignment of tracks and axes. 6. Workshop Environment Enhancement To ensure a cleaner and safer workspace, the equipment features air curtains at the track entrance and exit, preventing fumes from escaping. It also includes a dedicated exhaust outlet, improving overall workshop air quality. 7. Intuitive Programming and Visualization The I.C.T-T550 PCB Coating Machine allows flexible coating path editing through intuitive programming. The equipment employs a teach mode for programming, offering a visual interface for coating path design. 8. User-Friendly Interface with Practical Design Featuring a user-friendly interface with fault alerts and menu displays, the I.C.T-T550 delivers a sleek and practical design. 9. Streamlined Repetition and Data Management Efficiency is paramount, and the I.C.T-T550 offers the ability to mirror, array, and replicate coating paths, simplifying the process, especially with multiple boards. 10. Real-Time Data Monitoring The equipment automatically collects and displays data, including production volume and individual product work times, enabling effective production performance tracking. 11. Smart Adhesive Management The I.C.T-T550 intelligently monitors adhesive levels, providing automatic alerts for replenishment, ensuring uninterrupted coating. In summary, the I.C.T SMT PCB coating machine seamlessly combines precision, automation, and smart features to meet the demands of Industry 4.0. With integration into MES systems, it provides a reliable and efficient solution for elevating PCB coating processes. The I.C.T-T550's adherence to European safety standards and CE certification underscores our commitment to safety and compliance. For further inquiries or information about additional safety standards, please contact us. Whether optimizing coating quality or enhancing factory productivity, the I.C.T-T550 marks a step into the future of intelligent manufacturing. Explore a variety of coating valves or seek guidance by reaching out to us.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Videos: pressures (538)

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Videos

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Heller Industries Inc.

Time Pressure with Real Time Process Control FPC

Time Pressure with Real Time Process Control FPC

Videos

Time Pressure Liquid Dispensing Pump with Foot switch / Dry contact A great addition to Fully Automatic Dispensing System Time pressure is a versatile method of dispensing that functions across a wide range of viscosities. This dispensing method wo

GPD Global

Events Calendar: pressures (3)

Critical Environmental Requirements for Electronics Conference

Events Calendar | Tue Jun 09 00:00:00 EDT 2020 - Tue Jun 09 00:00:00 EDT 2020 | ,

Critical Environmental Requirements for Electronics Conference

Association Connecting Electronics Industries (IPC)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Jobs: pressures (24)

FACILITIES ENGINEER

Career Center | BIDDEFORD, Maine USA | Engineering,Maintenance

Searching for a Facilities Engineer with a strong Mechanical and/or Industrial background. Experience facilitating the design of machinery and equipment in a fast paced environment required. Strong knowledge of facilities and building maintenance a

Fiber Materials, Inc.

Manufacturing Process Engineer

Career Center | Clarksburg, Maryland USA | Engineering,Production,Quality Control

Thales Communications, Inc. is currently seeking a hands-on Manufacturing Process Engineer to support electro-mechanical manufacturing in our Clarksburg, MD facility. The candidate must be driven with a strong ability to multi-task under pressure.

Thales Communications, Inc.

Career Center - Resumes: pressures (28)

varshanth resume

Career Center | madak, AP India | Engineering,Research and Development,Technical Support

i have zero experience.

12 Years experience in Equipment, Manufacturing and Technical Support.

Career Center | , | Engineering,Technical Support

COMPETENCIES & SKILLS : Proficient in SMT chip Mounters and IC/Flip chip Placers like Assembleon, Panasonic, Yamaha & etc. Experienced in handling Screen Printers like Minami, Dek, Panasonic and semi-automatic Printers. Expert in Camalot

Express Newsletter: pressures (69)

SMT Express, Issue No. 1 - from SMTnet.com

SMT Express, Issue No. 1 - from SMTnet.com Volume 1, Issue No. 1 Thursday, June 3, 1999 Tricks of the Trade Optimizing Time/Pressure Dispensing ofAdhesives by Chrys Shea Over the past decade, depositing adhesives for SMT components

SMT Express, Issue No. 1 - from SMTnet.com

SMT Express, Issue No. 1 - from SMTnet.com Volume 1, Issue No. 1 Thursday, June 3, 1999 Tricks of the Trade Optimizing Time/Pressure Dispensing ofAdhesives by Chrys Shea                           Return to Previous Page Over the past

Partner Websites: pressures (582)

PCB Delamination: Understanding What Separation Anxiety Is Really All About - EPTAC - Train. Work Sm

| https://www.eptac.com/webinars/delamination-causes-and-cures/

? Delamination is showing up more and more today due to increased thermal pressures on assemblies. So how do you address these issues? Learn how this occurs in the production and assembly process, how to deal with it and understand the difference between true delamination and other forms of separation such as measling, haloing and crazing

Vacuum Applications-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,23578&url=_print

% total void area Reflow time under a vacuum of 15 seconds was able to achieve <1% total void area specification All pressures tested < 20 Torr met <1


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