Brief Description: Tropical Assemblies, Inc. is a 10 + year Electronic Contract Manufacturer of RF and Complex Printed Circuit Board Assemblies. Full turnkey operation from prototyping to full production box builds. On staff RF Engineering and assign
SMTspares.com is a community driven spare parts locator for the SMT and PCB assembly industry. Membership registration takes only a minute and is completely FREE. We link sellers to buyers of parts.
ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc. ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat
New Equipment | Education/Training
IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics
Electronics Forum | Thu Apr 28 17:09:28 EDT 2005 | jsloot
Does anyone have any articles about performing the green stick test for IC leads? If there are no printed articles then perhaps I can get a good description from you on the proper usage of one. I would like to know from your experiences any pros and
Electronics Forum | Tue Feb 29 14:10:09 EST 2000 | Glenn Robertson
Steve - I believe you should ask who has NOT dealt with this before. Search the archives for "dark pad" or "black pad". It's a common problem for immersion Gold. Does anyone Know any other descriptive names that I missed (and can be printed
Used SMT Equipment | Screen Printers
EKRA X5 Professional Large, Screen and Stencil Printer Type: X5 Prof Large Serial Nr.: 805843 Year of Manufacture: 2014 Direction: Left to Right Voltage: 400V, 50/60Hz, 3 Phases Air Pressure: 6 Bar Printing Area: min.: 80x50mm, max.: 660x550mm Printe
Used SMT Equipment | Screen Printers
Make: Speedline MPM Model: 3030 Description: Screen Printer Vintage: 1995 Software level: 7.1D Details: • 29 x 29 Max stencil size • Paste Dispenser • Retractor • Programmable squeegee • Electrical Z brake • 2D Post Print Inspection • Vac
Industry News | 2003-05-22 08:54:17.0
Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies
Industry News | 2016-04-07 08:47:23.0
The electronics industry has never settled on a single approach for moving printed board design data to manufacturing. With the release of IPC-2581B, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology, design engineers now have a way to organize and convey printed circuit board designs from CAD tools in a single intelligent file to manufacturing for fabrication, assembly and test.
Parts & Supplies | SMT Equipment
MPM printing system hard disk of DOS Name: MPM printing system hard disk, DOS version of the software Part Number: MPM printing system hard disk, DOS version of the software Description: For AP; APHIE; AP EXCEL; UP2000; UP2000HIE DOS system such
Parts & Supplies | SMT Equipment
MPM printing system hard disk of DOS Name: MPM printing system hard disk, DOS version of the software Part Number: MPM printing system hard disk, DOS version of the software Description: For AP; APHIE; AP EXCEL; UP2000; UP2000HIE DOS system such
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Technical Library | 2015-12-17 17:24:17.0
Product quality can be improved through proper application of design for test (DFT) strategies. With today's shrinking product sizes and increasing functionality, it is difficult to get good test coverage of loaded printed circuit boards due to the loss of test access. Advances in test techniques, such as boundary scan, help to recover this loss of test coverage. However, many of these test techniques need to be designed into the product to be effective.This paper will discuss how to maximize the benefits of boundary scan test, including specific examples of how designers should select the right component, connect multiple boundary scan components in chains, add test access to the boundary scan TAP ports, etc. A discussion of DFT guidelines for PCB layout designers is also included. Finally, this paper will include a description of some advanced test methods used in in-circuit tests, such as vectorless test and special probing methods, which are implemented to improve test coverage on printed circuit boards with limited test access.
IPC Vice President David Bergman explains where to find and how to use the Document Revision Table.
600mm Penumatic V-groove PCB Cutter Linear Blades PCB Separator Penumatic V-groove PCB Cutter Description: In order to improve the output of printed circuit board (PCB) manufacturing and the linear speed of surface mount (SMT), the printed circ
Training Courses | | | IPC Designer Certification CID
The Certified IPC Designer CID (Certified Interconnect Designer) course is the industry's premier professional development program for experienced PCB design professionals.
Training Courses | | | IPC Designer Certification CID
The Certified IPC Designer CID (Certified Interconnect Designer) course is the industry's premier professional development program for experienced PCB design professionals.
Events Calendar | Sat Jun 15 00:00:00 EDT 2019 - Thu Jun 20 00:00:00 EDT 2019 | Raleigh, North Carolina USA
IPC SummerCom
Events Calendar | Tue Aug 11 00:00:00 EDT 2020 - Tue Aug 11 00:00:00 EDT 2020 | ,
SMTA/iNEMI Webinar: Non-Contact Additive Processes for Contemporary Electronics Production
Career Center | Boxborough, Massachusetts USA | Engineering
Provide manufacturing engineering support for new and sustaining Appian printed circuit board and electro-mechanical subassemblies. For a detailed job description please see: http://www.appiancom.com/career.htm
Career Center | Addison,Texas, Texas USA | Engineering
Site Location: Charlotte, NC USA Description: Requires a BSIE or eqivalent and five years of Surface Mount Technology experience with printed circuit boards and components. Using FUJI CP6 CP4 IP2 IP3.STRONG NPI BACKGROUND.
Career Center | Riyadh 11623, Philippines | Engineering,Maintenance,Production
PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou
Career Center | , | 2013-01-31 04:29:34.0
• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010