Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Industry Directory | Consultant / Service Provider / Manufacturer
Since 1986, our focus on delivering quality PCB's and Assemblies hasn't changed. Our top priority has always been to understand what the customer values, evaluate their needs and deliver the best-in-class service and products.
New Equipment | Education/Training
IPC - Association Connecting Electronics Industries® offers globally recognized industry-traceable training and certification programs on key Electronics Industry Standards. Blackfox, founded in 1996, is the premier Worldwide Approved IPC Training Ce
Affordable Manufacturing Execution System (MES), Shop Floor Automation and Integration Software CELLS WORKFLOW Product Tracking MES is an affordable full Manufacturing Process Control Software System providing Plant Intelligence for any industry.
Electronics Forum | Fri Sep 02 19:31:40 EDT 2011 | jlawson
I agree that if information is processed correctly up front in process down stream QA becomes less expensive ie AOI etc as AOI at end of lines is telling you you have made mistakes in up stream. I better to eliminate mistakes or have process to avoid
Electronics Forum | Tue Feb 11 12:44:32 EST 2014 | cyber_wolf
Jigo, We have never had a need to do internal testing on solder paste, and your paste supplier should be able to tell you what the correct operating temperature range is. All of the big names in solder paste have tight quality control and I suspect t
Used SMT Equipment | Screen Printers
2002 Speedline UP 2000 Hi E Screen Printer Refurbished by OEM in 2006 Serial: 21223 Features: Cognex 5000; 4 Axis Motion Control; Tactile Sensor; Pass Through Conveyor; 2D Post Print Inspection; Y Snuggers; Vacuum Stencil Wiper;
Used SMT Equipment | Screen Printers
MPM-COOKSON, Serigraphic printing machine, type SPEEDLINE ULTRAPRINT 3000 - UP 3000/A, s.n. UO826/RF, with contrast support pins, online automatic frame cleaning (paper and solvent), double center camera 2D ( fiducial control 2D paste inspection), in
Industry News | 2023-06-12 21:14:11.0
The 2023 Beijing Intelligent Manufacturing and SMT Technology Exchange Conference, hosted by the Intelligent Manufacturing Committee of the Beijing Electronics Society, was successfully held in Beijing on May 25th. HELLER was honored to be invited and actively participated by sharing their cutting-edge technology and expertise.
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
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Parts & Supplies | Screen Printers
Name: P8466 MPM printing system hard, WIN NT version of the software Part Number: P8466 Description: For UP2000HIE; NT operating system of the machine Applicable models: UP2000HIE P8466 MPM printing system hard, WIN NT version of the softwa
Parts & Supplies | SMT Equipment
MPM printing system hard(P8466) Name: P8466 MPM printing system hard, WIN NT version of the software Part Number: P8466 Description: For UP2000HIE; NT operating system of the machine Applicable models: UP2000HIE P8466 MPM printing system
Technical Library | 2023-01-17 18:07:31.0
To achieve higher levels of consistency in PCB output, process engineers are able to maintain tighter controls and reduce process-related defects by using closed-loop process controls. At every stage of assembly, from screen printing through placement to reflow, closed-loop systems help control the variable factors that can have adverse effects on the process.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
http://www.gpd-global.com Tilt-and-Rotate configuration is available. Full featured programming makes conformal coating processes quick and easy. 3-axis Conformal Coating System for printed circuit boards that provides a reliable robotic platform f
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Training Courses | | | IPC J-STD-001 Space Trainer (CIT)
The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.
Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Career Center | Rolling Meadows, USA | Quality Control
Technical Trainer Professional solder training company is seeking individual to teach solder skills-based training as well as other electronics assembly courses. Individual should be able to communicate effectively with others. Training or teaching
Career Center | Rolling Meadows, Illinois USA | Quality Control
Job: PCB Assembly/Soldering Instructor Responsibilities: Provide instruction to students in IPC classes IPC-A-610, IPC JSTD-001, IPC 7711/21, IPC-A-620 Provide instruction to students in BEST classes Provide course content for and instruction to stu
Career Center | seoul, South Korea | Engineering
I have 4 year process engineering in Motorola and 7 years service experience in Assemblen . 2 years in Mirtec AOI as service manager .
Career Center | , California | Quality Control
Tammy T Vo P.O. Box 2213 (714) 254-5073 E-mail: nhutamvo@yahoo.com Position of Interest Senior Quality Inspector Aerospace Manufacturing. / Electronic PCBA/Advanced coating technologies Profile of Qualifications 12 years of experience wo
SMT Express, Volume 3, Issue No. 10 - from SMTnet.com Volume 3, Issue No. 10 Thursday, October 18, 2001 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: Coomb's Printed
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