New Equipment | Fabrication Services
Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.20MM Minimum drilled hole diameter: 8mils Copper thickness: 0.5oz Special process : 0.40MM BGA , golden fingers
New Equipment | Fabrication Services
Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.60MM Minimum drilled hole diameter: 4mils Copper thickness: 0.5oz Special process : 0.25MM BGA , resin plugged vias in BGA pads
Electronics Forum | Thu Jan 09 06:35:14 EST 2003 | mk
Consider ssd. Eliminate paste application. No printing necessary. www.sipad.net mk
Electronics Forum | Thu Jan 16 09:44:55 EST 2003 | Evtimov
hi, I have experience in placing BGA's with this pitch and it's OK.Tell me more about your problem(printing ,placing, accuracy rotation) or whatever ti is.
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training
. Call the BGA Experts at (888) 406-2830 for more details. Also see: http://www.pcb-repair.com/training/bga-rework-process-implementation/ Share 0 Share on Facebook Tweet Tweet on Twitter Pin it 0 Pin on Pinterest Fancy Add to Fancy +1
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2019/08/pressurecureoven.pdf
: 25 – 40 psi 200℃ 60℃ 0 Temp. 30min 90min 120min Time 10 bar 0 20min 90min 110min Time Cooling process Curing process Rising process Pressure
winsouce.jpg)