Industry Directory | Equipment Dealer / Broker / Auctions / Manufacturer
Focusing on the SMT field for more than 15 years, QYSMT has been committed to meeting the needs of customers and partners. Our mission is to provide the best solutions while helping to reduce costs and increase efficiency.
Industry Directory | Distributor / Manufacturer's Representative
Grip Technologies manufactures all forms of component processing equipment.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Effective Solutions for any Odd-Form Application on any OEM Platform. Count On Tools has the experience and manufacturing flexibility to be able to develop custom engineered solutions to satisfy your individual Process Requirements. With over 20 y
Electronics Forum | Thu Jun 12 03:34:23 EDT 2003 | sanjeevc
I would like to ask a question about SMT reflow > process. I did 10 pcs samples but all is fail. > The sample is double faces to have components > (up-side has 4 pcs of BGA and down-side has 3 BGA > and 2 QFP). And I saw some of BGA which is > t
Electronics Forum | Fri Mar 20 05:07:16 EDT 2009 | rocko
Hi All, I was puzzled because of terrible blowholes in solder joints of gold plated odd-form components. I am very confused because all other components on the boards have perfect solder joints. Here are some process details: 1) Solder paste: N
Used SMT Equipment | SMT Equipment
Product name: YC8 small modular chip mounter Product number: YC8 Products in detail Features: support large irregular component small modular placement machine Object substrate: L50 W50mm ~ L330 W360mm x x (1) does When using standard componen
Used SMT Equipment | SMT Equipment
Product name: YC - 8 YAMAHA irregular chip mounter Product number: YC - 8 Products in detail Object substrate: L50 W50mm ~ L330 W360mm x x (1) does When using standard components: absolute accuracy (including + 3 sigma) : + / - 0.05 mm/QFP Rep
Industry News | 2024-06-21 17:26:01.0
Don DeAngelo, Vice President of Sales at Heller Industries, and a stalwart in the SMT industry, has retired. Don joined Heller Industries in July 1984 and guided Heller's Eastern US sales efforts through the transition from lead forming equipment to reflow ovens in the 1980s.
Industry News | 2017-01-26 19:53:00.0
GPD Global will exhibit in Booth 2933 at the upcoming IPC APEX EXPO 2017 scheduled to take place February14-16, San Diego Convention Center. GPD Global will officially launch its new, fully automated dispense platform, Hyperion, and a new, low cost conformal coating system.
Parts & Supplies | Pick and Place/Feeders
Yamah YV100 II parameter 1. Highways based on the reliability of basic structures 2. Paste of protective elements 3.0.25 seconds / CHIP high-speed mount 4. Can mount 0.5 foot spacing 32mm QFP 5. High Speed Image Processing 6.2 cameras reduced p
Parts & Supplies | Pick and Place/Feeders
Equipment introduction: Fuji mounter AIMEX II: Fuji mounter AIMEX II is a multi-functional integrated mounter for various production forms from trial production to mass production. It has a large-capacity material station capable of carrying various
Technical Library | 2021-09-02 08:17:07.0
We are a professional manufacturer of PCB depaneling machines, which is workable for all boards, including flex and regid boards, v-scored boards and routed boards. Laser pcb depaneling is non-contact way without mechanical stress,this solution is good for modern precision PCB depaneling. It has below advantages: 1. No dust The production environment of the circuit board industry is carried out in the dust-free workshop. The traditional pcb depaneling equipment, such as blade moving type machine, will inevitably produce residues and micro powder, which will pollute the 10000 and 1000 class dust-free workshops and affect the conductivity of products. The UV laser PCB cutting machine is a vaporization processing process, which will not produce dust and is conducive to the conductivity of the product. 2. High cutting precision The processing gap of high-precision traditional processing equipment can not reach the gap width of less than 100 microns, which will cause certain damage to the lines on the edge or PCBA circuit board containing components. The focus spot of the laser cutting machine is small, and the ultraviolet cold processing mode has little thermal impact on the edge of the circuit board. The cutting position accuracy is less than 50 microns, and the cutting size accuracy is less than 30 microns, which will not affect the edge of the circuit board, and the precision is high. 3. No stress Traditional processing methods generally have V-grooves, which will cause certain damage to the board in the manufacturing process. The UV laser PCB cutting machine can directly cut the bare board without making V-grooves. In addition, the traditional processing methods directly use tools to act on the circuit board, especially the stamping method has a great impact on the circuit board, which is easy to cause board deformation. The laser cutting machine is a non-contact processing mode, which acts on the surface of the material through the high-energy beam, which will not cause the influence of stress and the deformation and damage of the circuit board. 4. For special-shaped cutting, it is easy to automate The UV laser PCB cutting machine can cut for any shape without replacing any props and fixtures, and without steel mesh. The same equipment can meet special-shaped and straight-line cutting, which is easy to realize assembly line automatic production and high flexibility. It is easy to improve production efficiency and save production process and production cycle. In particular, it can quickly and efficiently meet the needs of rapid proofing, directly import the drawing, and then locate the cutting. 5. High compatibility The UV laser PCB cutting machine can process the materials around the circuit board, such as PCB, FPC, covering film, pet, reinforcing board, IC, ultra-thin metal cutting, etc. it has strong practicability, is compatible with the processing of a variety of materials, is easy to operate, can be imported into the drawing, does not need to adjust any mechanical parts, and is easy to operate and maintain. 6. Good cutting edge effect The cutting edge is smooth and neat without burr. It can be processed and formed directly according to the size of the drawing, which is conducive to improving the yield of the product. It can be directly installed into the subsequent process without further processing. For more details about UV laser depaneling, please feel free to contact us. www.pcbdepanelingrouter.com
Technical Library | 2019-06-03 15:32:40.0
ACI Technologies was pleased to assist a customer by conducting elemental analysis on several assemblies displaying severe corrosion. Several board assemblies had failed in the field and exhibited areas of corrosion in close proximity to onboard components. The most common source of corrosion on electronic assemblies is residual flux. Fluxes are specific chemistries applied during the soldering process which improve the wetting of the solder to both the pad and component when forming the solder joint. They can be highly reactive chemicals that, if left on the assemblies, can lead to corrosion, electrical degradation, and decreased reliability. In the presence of moisture and electrical bias, flux residue can enable dendritic growth as a result of electrochemical migration (ECM).
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Training Courses | | | IPC J-STD-001 Space Trainer (CIT)
The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.
Events Calendar | Thu Mar 25 00:00:00 EDT 2021 - Thu Mar 25 00:00:00 EDT 2021 | ,
Webinar: Process Control to Ensure Electrochemically Reliable Electronics
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Career Center | Charlestown, Indiana USA | Quality Control
Assists team in making checks of product according to document system procedures. Assists in training production associates on basic measuring equipment, Quality sheets and In-Process-Inspection Forms Performs product tests against engineeri
Career Center | , Colorado USA | Engineering,Quality Control
Plans and directs activities concerned with quality standards at contract manufacturers. Responsible for developing and initiating standards and methods for inspection, audits, and evaluation. Responsible for the proper calibration of all test and me
Career Center | makrana, rajasthan India | Production
Responsible for SMT (NXT Fuji) line production performance. Operator of AOI (Automatic Optical Inspection) with ORBOTECH (vintage-S22, Symboin-S36).. P.C.B. quality-TRX,PA,NPU,PFU,MMU,RAU etc.
Career Center | makrana, rajasthan India | Production
Responsible for SMT (NXT Fuji) line production performance. Operator of AOI (Automatic Optical Inspection) with ORBOTECH (vintage-S22, Symboin-S36).. P.C.B. quality-TRX,PA,NPU,PFU,MMU,RAU etc.
GPD Global | https://www.gpd-global.com/leadformers-cf8.php
. Lock-in tooling prevents component "float" during wave solder process. Stand-off or flushmount lock-in forms for components with lead diameter from .015" to .060" (0.38 mm to 1.52 mm
| https://www.eptac.com/webinars/delamination-causes-and-cures/
? Delamination is showing up more and more today due to increased thermal pressures on assemblies. So how do you address these issues? Learn how this occurs in the production and assembly process, how to deal with it and understand the difference between true delamination and other forms of separation such as measling, haloing and crazing
