New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
New Equipment | Rework & Repair Equipment
RS-300Q set for SMD/BGA rework Integrated device: HOT-AIR station, quartz preheater and control computer 3 zone quartz preheater Preheater of A3 size Power of lower preheater: 3.4kW Power of upper preheater: 500W Smooth temperature adjustment
Electronics Forum | Thu Jul 23 16:49:04 EDT 1998 | Ted
I was wondering how successful industry has been in quantifying relationships between defects rates of particular solder problems (like bridging, opens,..) and PCA design parameters (like spacing, part orientation, pad dimensions, ...). For wave sol
Electronics Forum | Tue Nov 01 15:26:43 EST 2005 | GS
Is it this your first experience of C-CGA RWK ? In order to approach a RWK of this kind of pakage it requires a capable process and clear operating procedure. In the past, the company who I use to work for, we rwkd plenty of this kind of CCGA. Earl
Industry News | 2019-10-15 14:59:59.0
Nordson ASYMTEK introduces Qadence™, a closed-loop system that automatically compensates for viscosity changes during conformal coating. This innovative system combines the capabilities of Nordson ASYMTEK's conformal coating hardware and software to selectively apply coating to specific areas of a circuit board consistently throughout production. The Qadence flow control system maintains stable fluid application, flow rates, and performance by automatically compensating for viscosity changes related to temperature, humidity, and batch-to-batch variation. It eliminates the need for frequent operator adjustments and downtime to recalibrate the process.
Industry News | 2011-03-31 11:54:23.0
Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.
Technical Library | 2017-05-25 17:07:39.0
Purpose of this research is to identify the factors that directly influence the effectiveness of the fluxing process in selective soldering machines, using the design of experiment methodology with associated factors and levels used in the experiment. Final findings gives directions for set up of the optimal fluxing parameters that will enable appropriate flux appliance and to gain reduction of soldering quality issues which foundations are from this process.
Technical Library | 2008-03-18 12:36:31.0
This paper examines the construction of a notebook mainboard with more than 2000 components and no wave soldering required. The board contains standard SMD, chipset BGAs, connectors, through hole components and odd forms placed using full automation and soldered after two reflow cycles under critical process parameters. However, state of the art technology does not help if the process parameters are not set carefully. Can all complex BGAs, THTs and even screws be soldered on a single stencil? What will help us overcome bridging, insufficient solder and thombstoning issues? This paper will demonstrate the placement of all odd shape components using pin-in-paste stencil design and full completion of the motherboard after two reflow cycles.
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
Events Calendar | Thu Jun 14 00:00:00 EDT 2018 - Fri Jun 15 00:00:00 EDT 2018 | ,
SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc7351-placement-tolerance-setting_topic1733_post7094.html
. It's a User Definable setting. I would also make the fabrication tolerance 0 because every fabrication shop swells the outer layer etch to compensate for their etching process tolerance
| https://www.smtfactory.com/What-is-the-parameter-debugging-skills-of-the-Full-auto-SMT-Stencil-Printer-id3338478.html
% of the quality problems in the SMT process quality are determined by the Full-auto SMT Stencil Printer process. Whether the Full-auto SMT Stencil Printer printing process parameter setting is reasonable is directly related to the quality of the printing, which requires
