Industry Directory | Consultant / Service Provider / Manufacturer / Research Institute / Laboratory / School
SMT & PCBA Laboratory Services, X-ray inspection, BGA rework, BGA Reballing, Solder Failure Analysis, SMT Assembly Process Validation, SMT Assembly Process Training & Consulting.
Industry Directory | Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
Labeling, printing and data collection solutions for the electronics industry
New Equipment | Education/Training
Please visit our main X-ray Training Class page for more information. PSI's comprehensive X-ray inspection training class leverages X-ray technology to help your SMT inspection and quality personnel improve quality and quickly diagnose problems. You
PROCESS SCIENCES, INC. (PSI) Visit our main Laboratory Services page for more information. Failure Analysis, Material & Process Qualification. We are an analytical services laboratory dedicated to the electronic circuit assembly, printed circu
Electronics Forum | Thu Dec 22 06:46:01 EST 2011 | rameshraja
Dear All, We are doing PCBA's manufacturing,Inprocess we are doing manual soldering, reflow and wave soldering process, As per ISO-7.5.2 Process validation ( Special process ) Soldering process is considered as an special process, hence in order to
Electronics Forum | Mon Jul 15 11:36:18 EDT 2013 | rgduval
Some great legal language here, Dave. Guess some people don't like their knowledge being shared. Probably shouldn't publish it to the interwebs if that's the case.
Used SMT Equipment | Pick and Place/Feeders
SMTpark, since 2009, is a high-precision SMT pick-and-place machine supplier that specializes in accurately matching production process and capacity requirements.Looking for high-precision SMT pick-and-place machines? Choose SMTPark for products that
Used SMT Equipment | Pick and Place/Feeders
SMTpark, since 2009, is a high-precision SMT pick-and-place machine supplier that specializes in accurately matching production process and capacity requirements.Looking for high-precision SMT pick-and-place machines? Choose SMTPark for products that
Industry News | 2003-06-02 09:14:01.0
Specification-Driven Circuit Design Environment Now Slashes Validation Time Up to 10x
Industry News | 2003-06-26 09:02:38.0
The surface quality of printed circuit boards and components directly impacts performance and product life.
Parts & Supplies | Pick and Place/Feeders
SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair 1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f
Parts & Supplies | General Purpose Equipment
Part Number: 3051TG5A2B31JB4E8Q4Q8M6P1 Model: In-Line Pressure Transmitter Brand: Rosemount Ordering Information Model: 3051T(1) - In-Line Pressure Transmitter Pressure Type: G - Gage Pressure Range: 5 - -14.7 to 10000 psi (-1,01 to 689,47 bar
Technical Library | 2024-08-29 18:30:46.0
The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study
Technical Library | 2010-03-18 14:02:03.0
Selecting products that have been qualified by industry standards for use in printed circuit board assembly processes is an accepted best practice. That products which have been qualified, when used in combinations not specifically qualified, may have resultant properties detrimental to assembly function though, is often not adequately understood. Printed circuit boards, solder masks, soldering materials (flux, paste, cored wire, rework flux, paste flux, etc.), adhesives, and inks, when qualified per industry standards, are qualified using very specific test methods which may not adequately mimic the assembly process ultimately used.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Semi-automated, programmable X-ray inspection system with multi-axis for prototyping, failure analysis, manufacturing process validation and rework verification for PCBs up to 18 x 20". The XT-3 is a high quality high-resolution manual x-ray inspecti
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Training Courses | | | IPC J-STD-001 Trainer (CIT) Recert.
The Certified IPC J-STD-001 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC J-STD-001 (CIS) training.
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
Events Calendar | Tue Sep 22 00:00:00 EDT 2020 - Tue Sep 22 00:00:00 EDT 2020 | Eden Prairie, Minnesota USA
Risk Analysis in Electronic Assemblies
Career Center | Gaylord, Michigan USA | Engineering
Reptron Manufacturing, a growing contract manufacturer, needs an engineer experienced in various manufacturing processes to include thru-hole assembly, hand solder, and automation through final packaging. You will ensure that machines are maintained
Career Center | Huntington Beach, California USA | Engineering
Trantronics, Inc. A well-established electronics assembly company who specializes in outstanding customer services and on time delivery is seeking a motivated hardworking individual to john our team at the Hunting Beach location. Responsibilities
Career Center | BANGALORE, India | Engineering,Maintenance,Production
Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance
Career Center | Mysore, India | Engineering,Production,Quality Control,Technical Support
· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc
Validity of the IPC R.O.S.E. Method 2.3.25 Researched Validity of the IPC R.O.S.E. Method 2.3.25 Researched This paper researches the effectiveness of the R.O.S.E. cleanliness testing process for dissolving and measuring ionic contaminants from
DOE for Process Validation Involving Numerous Assembly Materials and Test Methods DOE for Process Validation Involving Numerous Assembly Materials and Test Methods Selecting products that have been qualified by industry standards for use
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