Eliminate manual periodic profiling KIC Vision² utilizes temperature and speed sensors embedded in the oven for consistent and accurate profile measurements of the processed PCB Programming and Frequencies A single manual profile run wit
Akrometrix Studio is an advanced set of integrated software modules that work together to provide the most comprehensive set of surface characterization and analysis capabilities available. When used with the TherMoiré AXP surface measurement system,
Electronics Forum | Tue Dec 19 16:26:24 EST 2006 | samir
Grant, Newer lead-free fluxes have 6%-10% solids content - more activator, therefore leave more "visible" residues. Old technology tin-lead fluxes got down to as low as around the 4%-6% range (I'm going off memory, so me might be wrong)... You'll
Electronics Forum | Sun Aug 26 12:40:59 EDT 2001 | stefwitt
I would like to enter the discussion by tossing some numbers in. First of all I don�t like the 3 Sigma value. 3 Sigma are 2000 defects per mio. if I remember correctly. This means, if you have 200 components on the board, then every 10 boards have on
Used SMT Equipment | Pick and Place/Feeders
JUKI KE-2080 Pick and Place Machine Since entering the electronics industry equipment field in 1987, JUKI has pioneered a new field with its original modular mounters that match the production innovation required by the electronics industry. The comp
Industry News | 2003-05-29 08:30:31.0
Losses halved in the first half year � New organization of electronics group next on the agenda
Industry News | 2018-10-18 08:42:00.0
Reflow oven zone temperature set up and thermal profile
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2016-09-12 10:16:04.0
It is hard to open an Industry newsletter or visit an equipment manufacturer’s website without coming across a mention of the Internet of Things (IoT), Industry 4.0, SMART Manufacturing or ‘big data’. The accessibility to obtain data will only increase and this information and its real-time processing will become one of the most important resources for companies in the future. Production machinery will no longer simply processes the product, but the product will communicate with the machinery to tell it exactly what to do. Industry 4.0 has the vision to connects embedded system technologies and SMART production processes to drastically transform industry and production giving way to the SMART factory development. Future development in oven technology will allow machines to be controlled more intelligently and remotely resulting in the lowest cost model for manufacturing flow.
Aerotech's A3200 MotionPAC is a software-based Programmable Logic Controller (PLC) that is completely integrated with Aerotech's A3200 motion controller to increase programming efficiency, decrease development time and to increase quality. The Motion
Events Calendar | Tue Apr 28 00:00:00 EDT 2020 - Tue Apr 28 00:00:00 EDT 2020 | Halle (Saale), Germany
Keynote Presentation at 9th CAM Workshop: Physics of Failure Approaches and their Relevance and Applicability for Reliability Investigations and Qualifications especially in real Automotive Electronics
Career Center | BANGALORE, India | Engineering,Maintenance,Production
Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 42, (#ts#)) SMT Express, Volume 3, Issue No. 2 - from SMTnet.com Volume 3, Issue No. 2 Thursday, Febuary 15, 2001 Featured
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 46, (#ts#)) SMT Express, Volume 3, Issue No. 3 - from SMTnet.com Volume 3, Issue No. 3 Thursday, March 15, 2001 Featured
Heller Industries Inc. | https://hellerindustries.com/kic/
. KIC’s powerful profiling software reduces production downtime, rework and scrap while improving consistent performance. Smart Oven Technology All Heller reflow ovens are optionally supplied with smart oven technologies from KIC
KingFei SMT Tech | http://www.smtspare-parts.com/sale-11140440-kic-x5-thermal-profiler-with-spc-software-and-rf-capability-for-reflow.html
Track More Data Points With 7, 9, and 12-channel models, the X5 is able to acquire a lot of data, allowing you to precisely evaluate each thermal profile and process in your factory
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