Torrey S. Crane manufactures a complete line of industrial solders ranging from pure tin and lead with alloys with silver,bismuth,antimony,and cadmium.Crane solders meet and exceed J-STD-006,QQS-571and ASTM B32 standards and are ISO 9002 CERTIFIED
Industry Directory | Manufacturer
SHENMAO Technology, Inc. supplier of Pb/Pb-free Solder Pastes, Solder Wire, Solder Bar, Flux, BGA Sphere, Bumping Paste/Flux, PCB Plating Anode, PV Ribbon Electronics Assembly Materials, for over 44 years from 10 world locations.
New Equipment | Solder Materials
KappaTinning Compound is a dry mixture of pure powdered Tin and flux specifically designed for pre-tinning cast Iron, Steel, Bronze and Copper bearing shells. A one pound container of KappaTinning Compound contains about twice as much Tin and goes fu
New Equipment | Assembly Services
Perfectly Controlled Immersion Tin System The Horizon Stannatech system is the leading immersion tin system within the entire PCB industry. Together with the Stannatech process and Atotech's unique Crystallizer and ConStannic control systems for im
Electronics Forum | Mon Jul 24 11:35:42 EDT 2006 | Jimk@ics-inc.org
We have experienced a problem with tin leaching or discoloration of lead terminals on random parts on solder side of a paste/paste operation. The profile has been used on previous production runs and there doesn't appear to be any heat damage to othe
Electronics Forum | Thu Jul 27 07:50:35 EDT 2006 | davef
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Industry News | 2010-04-30 18:47:15.0
SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.
Industry News | 2015-02-04 18:05:58.0
he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.
Technical Library | 2019-06-19 11:06:46.0
Tin (Sn) metal displays the characteristic of growing “tin whiskers” from pure tin coatings (most actively on relatively thin, electrodeposited or immersion tin coatings), usually months or years from the initial deposition of the tin. Tin whiskers are electrically conductive, filamentary, single crystals of white (beta phase) tin. These filaments of single crystal tin are usually one to five microns in diameter, and a few microns up to several tens of millimeters long, that grow spontaneously from the tin coatings. Alloying additions of several percent (by weight) of lead (Pb) prevents these electrically conductive tin whiskers from growing. Pb alloyed into the Sn was discovered to prevent the occurrence of tin whiskers in electronic assemblies in the 1950s as the Bell Laboratories solution to the problem of tin whiskers. The alloying of the tin with lead has thus quietly averted incalculable losses from short circuits in electronic equipment for the last 60 years.
Technical Library | 2012-08-16 22:38:05.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniqu
Quick Overview Solder dross separator SDS-10MS has Patent mixing and separation system which make separation more efficient and easier for operation, it is a best solution for small batch solder dross separation. To get more information from below
The EVS Solder Recovery system recylces solder form dross using no chemicals or additives, on site, in an efficient, easy process. As solder costs soar, manufacturers benefit from a quick ROI, reusing solder taken directly off their wave and processe
SMTnet Express, October 12, 2017, Subscribers: 30,913, Companies: 10,757, Users: 23,915 Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin David Pinsky, Tom Hester - Raytheon , Dr. Anduin Touw - The Boeing
SMTnet Express, June 4, 2015, Subscribers: 22,829, Members: Companies: 14,364 , Users: 38,296 Tin Whisker Risk Mitigation for High-Reliability Systems Integrators and Designers David Pinsky, Elizabeth Lambert; Raytheon Integrators and designers
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.Separated liquid pure tin automatically stored in the tin cabin, when it is reaches a certain volum, the alarm system turns on, operator just only need discharge the liquid pure tin into molding tray. 4
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. Some candidates are described below. Pure Tin. Tin has good wettability/solderability over a large range of substrates, making it an excellent choice for lead finish through tin plating
