Industry Directory | Manufacturer / Other
TWC manufactures custom Cable/wire harness for specific applications based upon customer design and print requirements. •Wire Leads, Battery Cables, Tinning and Soldering, Cable/Wire Harnesses, Power Cords, Ribbon Cable Assembly
New Equipment | Assembly Services
Perfectly Controlled Immersion Tin System The Horizon Stannatech system is the leading immersion tin system within the entire PCB industry. Together with the Stannatech process and Atotech's unique Crystallizer and ConStannic control systems for im
New Equipment | Solder Materials
Solder Wire from the Indium Corporation is made to demanding quality standards. Our flexible manufacturing process allows us to fulfill orders from evaluation/research quantities to full scale production volumes. Indium Solder Wire Diameters We m
Electronics Forum | Thu Jul 19 09:23:52 EDT 2007 | patrickbruneel
Chris, To my knowledge the only difference between leaded and lead-free components is the termination plating. What has changed in the component design that makes them resistant to higher temperatures?
Electronics Forum | Mon Jul 16 10:51:09 EDT 2007 | patrickbruneel
D. Hillman, et al., �The Impact of Reflowing a Pb free Solder Alloy Using a Tin/Lead Solder Alloy Reflow Profile on Solder Joint Integrity,� International Conference on Lead-free Soldering, CMAP, Toronto, Ontario, Canada, May 24-26, 2005, http://www.
Industry News | 2003-06-23 08:49:39.0
Three Organizations from the US, Europe and Japan to
Industry News | 2018-10-18 09:20:09.0
Product defects caused by the flux in the wave soldering process
Technical Library | 2017-10-12 15:45:25.0
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full advantage of this phenomenon, it is necessary to understand the conditions under which such coverage can be assured. A round robin study has been performed by IPC Task group 8-81f, during which identical sets of test vehicles were assembled at multiple locations, in accordance with IPC J-STD-001, Class 3. All of the test vehicles were analyzed to determine the extent of complete tin dissolution on a variety of component types. Results of this study are presented together with relevant conclusions and recommendations to guide high reliability end-users on the applicability and limitations of this mitigation strategy.
Technical Library | 2023-02-13 19:23:18.0
Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.
The EVS Solder Recovery system recylces solder form dross using no chemicals or additives, on site, in an efficient, easy process. As solder costs soar, manufacturers benefit from a quick ROI, reusing solder taken directly off their wave and processe
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
SMTnet Express, February 3, 2022, Subscribers: 25,970, Companies: 11,512, Users: 27,043 Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers If you've been in electronics for any length of time, the phenomenon
SMTnet Express, October 12, 2017, Subscribers: 30,913, Companies: 10,757, Users: 23,915 Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin David Pinsky, Tom Hester - Raytheon , Dr. Anduin Touw - The Boeing
ASCEN Technology | https://www.ascen.ltd/optical_inspection/1073.html
Product Details solder dross recycling machine tin slag recycle system manual ： PCB assembly equipment, ：2023-12-30 solder dross recycling machine used in the PCB electronic industry,it is designed to recover pure tin and solder dross from working impurities oxides generated from the wave soldering with
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-the-pcb-fabrication-process/
. Communication between the design team and manufacturers is critical, especially as manufacturing has moved overseas. In this post, we explore everything you need to know about the PCB fabrication process, including the pre-process, PCB fabrication in full, and considerations to make when choosing a PCB fabrication company
