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Semi-automatic Screwdriver Automatic feeding Smart control Big screw compartment Automatic counting Semi-automatic Screwdriver Main specifications: Product model SZ2800S Product size 410*163*266.5mm Product
New Equipment | Board Handling - Conveyors
PCB de-stacker Type Loader For SMT from SZTech SMT It can use as a loader or an unloader for bare PCB. Loading the PCB into the PCB de-stacker is very easy. It can save a lot of time for operators to insert the PCB into the PCB magazine. HMI touchs
Electronics Forum | Thu May 26 08:44:37 EDT 2005 | stepheniii
And would it be worth ressurecting anything from before the boom-bust a few years ago? There were a lot of cancelled orders for new machines and the market dropped out of the used equipment market. I'm sure most of the cancelled order machines are
Electronics Forum | Tue Jun 06 16:50:33 EDT 2006 | pjc
Push Back !! Check out this article: http://www.circuitnet.com/web/article_20181.shtml
Used SMT Equipment | Conveyors
Universal 1 Meter Inspection/ rework/ workstation. * Single Stage Edge belt * Adjustable rail width 3" to 20" * Board Length to 28" * Over head lighting * Moving, back rail mounted parts shelf * Adjustable foot rest * Inspection release
Used SMT Equipment | SMT Equipment
They received money of machines from a lot of companies, but no machines and no money back. The all reasons to these buyers are same, that is “we also didn’t get the machines from our supplier, we will push our supplier ASAP”. But one year goes, stil
Industry News | 2021-11-08 14:38:39.0
Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.
Industry News | 2011-11-03 21:52:00.0
By davef: I was fortunate to be able to attend the SMTAI Exhibition Oct. 18-19, 2011. While I was walking around looking at the booths and talking to the exhibitors, I got this idea that I would report back on things that I found interesting. You know spread the news, since not everyone was there.
Parts & Supplies | Assembly Accessories
YAMAHA K87-M111H-20X BACK STOPPER (CL8mm,CL12mm,CL16mm) More Yamaha parts in stock YAMAHA FEEDER PARTS CL84/82 K87-M111H-20X BACK STOPPER K87-M111B-00X BACK STOPPER AXIS KW1-M111A-00X SPRING K87-M111G-10X PUSH PIN K87-M111C-00X PLANE WASHER
Parts & Supplies | SMT Equipment
Ya main parts Part Name:COVER KUCT ASSY PART No:KV7-M221A-A0X Part Name:GUIDE (LWL9), YV100-2 PART No:K46-M9174-10X Part Name:YV100 SENSOR,1-3 DZ-7232-PN1 PART No:KM0-M655F-10X Part Name:YVL88 No:KG7-M7173-A0X Part Name:LEAF SPRING
Technical Library | 2020-09-23 21:37:25.0
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which has a melting point of about 139°C. Experience so far indicates that such Bi-Sn alloys do not have the mechanical properties and microstructural stability necessary to deliver the reliability required for the mounting of BGA packages. Options for improving mechanical properties with alloying additions that do not also push the process temperature back over 200°C are limited. An alternative approach that maintains a low process temperature is to form a hybrid joint with a conventional solder ball reflowed with a Bi-Sn alloy paste. During reflow there is mixing of the ball and paste alloys but it has been found that to achieve the best reliability a proportion of the ball alloy has to be retained in the joint, particular in the part of the joint that is subjected to maximum shear stress in service, which is usually the area near the component side. The challenge is then to find a reproducible method for controlling the fraction of the joint thickness that remains as the original solder ball alloy. Empirical evidence indicates that for a particular combination of ball and paste alloys and reflow temperature the extent to which the ball alloy is consumed by mixing with the paste alloy is dependent on the volume of paste deposited on the pad. If this promising method of achieving lower process temperatures is to be implemented in mass production without compromising reliability it would be necessary to have a method of ensuring the optimum proportion of ball alloy left in the joint after reflow can be consistently maintained. In this paper the author explains how the volume of low melting point alloy paste that delivers the optimum proportion of retained ball alloy for a particular reflow temperature can be determined by reference to the phase diagrams of the ball and paste alloys. The example presented is based on the equilibrium phase diagram of the binary Bi-Sn system but the method could be applied to any combination of ball and paste alloys for which at least a partial phase diagram is available or could be easily determined.
NG OK pcb magazine unloader|PCB NG OK unloader or double track magazine PCB unloader after AOI machine, receive the signal given by AOI https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/131.html ASCEN major for the PCB conveyor and t
NG OK pcb magazine unloader|PCB NG OK unloader or double track magazine PCB unloader after AOI machine, receive the signal given by AOI https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/131.html ASCEN major for the PCB conveyor and t
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