Electronics Forum | Thu Mar 17 10:30:06 EST 2005 | davef
This happens. You may need to put a dot of chip bonder on the corner of the floating QFP after first pass. What size are the QFP that are moving?
Electronics Forum | Thu Jan 10 18:32:20 EST 2008 | stevek
Our layout guy recently started making land patterns with the corner lands oversized. These are for leadless and various flatpack parts. He claims this is to improve manufacturing. I had seen a few boards with this just as I got out of the CM worl
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Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
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