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RD-500 Series BGA Rework Process

RD-500 Series BGA Rework Process

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- 3 Separate Heater for Lead Free Solder - 3 Points Cooling System - 5 Thermocouple Inputs - 2 Points Component Control Auto Profiling

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High Throughput Reflow Oven

High Precision Fluid Dispensers
Gordon Brothers October 2-30, 2024 Auction

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Circuit Board, PCB Assembly & electronics manufacturing service provider

Best Reflow Oven
PCB Depanelizers

"Heller Korea"