Product ID WSTM-MCTest-002 Model No. Communication module's functional test fixture Patent No. keyword index Test fixture for stamp hole, FCT test fixture for 3G
New Equipment | Test Equipment
Product ID WSTM-IC Test-004 Model No. BGA IC test jig for access controller Patent No. keyword index BGA test fixture, IC test jig, IC test pallet, IC test jig fo
Electronics Forum | Fri Apr 30 10:42:40 EDT 2021 | oxygensmd
I have a customer who ask close to prototyping jobs with low volume and high-mix components. A regular job have around 5-30 pieces board but have high quantity and many type of components. All the time over 1000 pieces of parts on board from 250-350
Electronics Forum | Tue Aug 23 03:29:37 EDT 2022 | samhe
I received a buck-boost DCDC board with an optical sensor from NextPCB, so I mounted the components and measured the efficiency. Table of contents Board received from NextPCB Solder paste printing Mounting of parts Reflow operation check Attaching
Used SMT Equipment | SMT Equipment
Rehm 回流焊 V7-3.8 CNX037 Rehm 回流焊 V7-3.8 CNX031 Rehm 回流焊 V7-3.8 CNX039 Rehm 回流焊 V7-3.8 CNX049 Rehm 回流焊 V7-3.8 CNX044 Rehm 回流焊 V7-3.8 CNX050 Rehm 回流焊 CSMS-V6-N2-3800180-400UK 0543 customerst@163.com
Used SMT Equipment | SMT Equipment
Rehm Reflow for sales : Rehm V7-3.8 CNX039 Rehm V7-3.8 CNX037 Rehm V7-3.8 CNX031 Rehm V7-3.8 CNX044 Rehm V7-3.8 CNX050 Rehm V7-3.8 CNX049 Rehm CSMS-V6-N2-3800180-400UK 0543 customerst@163.com
Parts & Supplies | Pick and Place/Feeders
We have the following new original Assembléon Nozzles available: AX Laser Aling CPL2 nozzle 0201-0402 9498 396 01396 AX Laser Align CPL3 nozzle 0402-0603 9498 396 01397 AX Laser Align CPL4 nozzle 0603-1206 9498 396 01398 AX
Parts & Supplies | Pick and Place/Feeders
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Send the Special Express To Others Email this Special Express to: Your friend Your co-worker A decision maker in your company A Colleague NOTE: You may re-use this e-mail form as many times
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/thermal-tab-vias_topic1151_post4582.html
- V1 -2.45 2.45 V2 -0.87 2.45 V3 0.87 2.45 V4 2.45 2.45 V5 -2.45 0.87 V6 -0.87 0.87 V7 0.87 0.87 V8 2.45 0.87 V9 -2.45 -0.87 V10 -0.87 -0.87 V11 0.87 -0.87 V12 2.45 -0.87 V13 -2.45 -2.45 V14 -0.87 -2.45 V15 0.87 -2.45 V16 2.45 -2.45 You can import a text file with coordinates to insert any specific pad stack
KingFei SMT Tech | https://www.smtspare-parts.com/sale-34559120-9498-396-01823-nozzle-o2-acm-o2-spec-grey-o-ring-assemble-ax201-03.html
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