Industry Directory: reflow cold spots (8)

Hydraulic presses - Hsin Lien Sheng Machinery Co., Ltd.

Industry Directory | Other

With twenty years of producing experiences, Hsin Lien Sheng Machinery Co., Ltd. is specialized in manufacturing Hydraulic presses, Hydraulic presses, Hydraulic Press, Die Spotting Press.

Lien Chieh Hydraulic Press Company

Industry Directory | Manufacturer / Other

Lien Chieh Machinery (LCM) established in 1947, specialized in manufacturing various kinds of hydraulic presses, inclusive of hydraulic die tryout press, hydraulic hemming press, etc.

New SMT Equipment: reflow cold spots (21)

RE-7500

RE-7500

New Equipment | Printing

- Flexible uses for all different kinds of Components like SMD, BGA, CBGA, CCGA, CSP, QFN, MLF, PGA and All Epoxy undefiled BGA .. etc . - Recommended for reworking All Plastic parts, PTH, Sockets, Connectors and Metal Shields . - Complete reworking

Jovy Systems Limited

Laser Cut Adhesive Stencils

Laser Cut Adhesive Stencils

New Equipment | Solder Paste Stencils

Laser cut stainless steel Adhesive Stencil for adhesive printing. Adhesive stencils are used to solder SMD components with a solder wave, whereas the components are fixed with an adhesive. The adhesive spots are print in one printing process by usin

LaserJob

Electronics Forum: reflow cold spots (287)

White spots on PCB

Electronics Forum | Fri May 11 11:52:25 EDT 2001 | jagman

Does anyone know what would cause a PCB to develop white spots all over the board following parts placement and reflow? I need help!!

White spots on PCB

Electronics Forum | Mon May 14 19:16:49 EDT 2001 | jagman

Dave: Actually, I'm located in the South Bay (Santa Clara)! Good guess. Now, for more in-depth information: So far, the distribution has been limited to one board out of 10 assembled, so far from one lot. The components assembled are exclusively

Used SMT Equipment: reflow cold spots (4)

FLIR T400

FLIR T400

Used SMT Equipment | In-Circuit Testers

The most affordable, feature rich infrared camera available! The new FLIR T400 is the most affordable feature rich infrared camera available! The T400 now has FLIR FUSION! FLIR's new FUSION functionality allows for easier identification and interpre

Test Equipment Connection

DIMA SMRO-4000

DIMA SMRO-4000

Used SMT Equipment | Soldering - Reflow

The SMRO-4000 Scirocco Reflow oven has been developed for reflow soldering of Hybrid boards, SMT boards and Curing Glue or thin film pastes. The machine is developed for medium to large series of assembly. The Scirocco is based on hot air convection.

Fix Trade BV

Industry News: reflow cold spots (86)

What is the working principle of I.C.T Lyra Reflow Oven

Industry News | 2022-11-11 07:33:41.0

Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.

Dongguan Intercontinental Technology Co., Ltd.

Clariant introduces pioneering Humitector™ Type 2 Non-Reversible Humidity Indicator Cards for SMD Dry Packing at Semicon Taiwan

Industry News | 2018-08-21 14:28:35.0

Clariant's new Humitector Type 2 Non-Reversible Humidity Indicator Cards contain a patent-pending non-reversible 60% humidity spot indicator which enables them to indicate whether dry packed surface mount devices (SMDs) have been exposed to high levels of moisture at any point during shipment or storage. This unique innovation offers a major step forward in preventing moisture-compromised surface mounts from entering production.

Clariant Cargo & Device Protection

Parts & Supplies: reflow cold spots (4)

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

Parts & Supplies | Assembly Accessories

Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,

KingFei SMT Tech

Yamaha HEAD SERVO BRD ASSY

Yamaha HEAD SERVO BRD ASSY

Parts & Supplies | Pick and Place/Feeders

KHY-M221A-A0 KGT-M221A-A0 YAMAHA YG12 tank chain gland KHY-M2267-00 YG12 tank chain YS12 towline keel X axis PISCO SP2550 R75 KHY-M2276-S0 YS12 screw X-axis YG12 X-axis screw  YG12F YS12F screw guide KHY-M371R-00 RAIL GUIDE 12P YS24 YS100 Feida pl

Qinyi Electronics Co.,Ltd

Technical Library: reflow cold spots (4)

UV Laser PCB Depaneling Machine Improve Cutting Effect

Technical Library | 2021-09-02 08:17:07.0

We are a professional manufacturer of PCB depaneling machines, which is workable for all boards, including flex and regid boards, v-scored boards and routed boards. Laser pcb depaneling is non-contact way without mechanical stress,this solution is good for modern precision PCB depaneling. It has below advantages: 1. No dust The production environment of the circuit board industry is carried out in the dust-free workshop. The traditional pcb depaneling equipment, such as blade moving type machine, will inevitably produce residues and micro powder, which will pollute the 10000 and 1000 class dust-free workshops and affect the conductivity of products. The UV laser PCB cutting machine is a vaporization processing process, which will not produce dust and is conducive to the conductivity of the product. 2. High cutting precision The processing gap of high-precision traditional processing equipment can not reach the gap width of less than 100 microns, which will cause certain damage to the lines on the edge or PCBA circuit board containing components. The focus spot of the laser cutting machine is small, and the ultraviolet cold processing mode has little thermal impact on the edge of the circuit board. The cutting position accuracy is less than 50 microns, and the cutting size accuracy is less than 30 microns, which will not affect the edge of the circuit board, and the precision is high. 3. No stress Traditional processing methods generally have V-grooves, which will cause certain damage to the board in the manufacturing process. The UV laser PCB cutting machine can directly cut the bare board without making V-grooves. In addition, the traditional processing methods directly use tools to act on the circuit board, especially the stamping method has a great impact on the circuit board, which is easy to cause board deformation. The laser cutting machine is a non-contact processing mode, which acts on the surface of the material through the high-energy beam, which will not cause the influence of stress and the deformation and damage of the circuit board. 4. For special-shaped cutting, it is easy to automate The UV laser PCB cutting machine can cut for any shape without replacing any props and fixtures, and without steel mesh. The same equipment can meet special-shaped and straight-line cutting, which is easy to realize assembly line automatic production and high flexibility. It is easy to improve production efficiency and save production process and production cycle. In particular, it can quickly and efficiently meet the needs of rapid proofing, directly import the drawing, and then locate the cutting. 5. High compatibility The UV laser PCB cutting machine can process the materials around the circuit board, such as PCB, FPC, covering film, pet, reinforcing board, IC, ultra-thin metal cutting, etc. it has strong practicability, is compatible with the processing of a variety of materials, is easy to operate, can be imported into the drawing, does not need to adjust any mechanical parts, and is easy to operate and maintain. 6. Good cutting edge effect The cutting edge is smooth and neat without burr. It can be processed and formed directly according to the size of the drawing, which is conducive to improving the yield of the product. It can be directly installed into the subsequent process without further processing. For more details about UV laser depaneling, please feel free to contact us. www.pcbdepanelingrouter.com

Winsmart Electronic Co.,Ltd

How to Manage Material Outgassing in Reflow Oven

Technical Library | 2020-11-24 23:12:27.0

In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-paste technology also increase solder paste use. More components and more solder paste result in more outgassing of chemistry during the reflow process. Some assemblies report condensation of vapors when the cold printed circuit board enters the oven. Little is known about the interaction between these condensed materials in terms of the interaction between these condensed materials and the reliability of the assembly. Apart from the question of reliability, a printed circuit board contaminated with a small film of residues after reflow soldering is not desirable.

Vitronics Soltec

Videos: reflow cold spots (20)

I.C.T Lyra Series Reflow Oven with CBS Function

I.C.T Lyra Series Reflow Oven with CBS Function

Videos

Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board

Dongguan Intercontinental Technology Co., Ltd.

How to Use and Read Humidity Indicator Card Type 2 - Humitector™

How to Use and Read Humidity Indicator Card Type 2 - Humitector™

Videos

A Sustainable Alternative - Humitector cards are halogen-free and cobalt dichloride free. Visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-humidity-indicator-card?utm_source=CLRYouTube&utm_medium=Vi

Clariant Cargo & Device Protection

Training Courses: reflow cold spots (1)

Hands-On Solder

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Skolnik Technical Training Institute, LLC

Events Calendar: reflow cold spots (2)

Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1

Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,

Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1

Surface Mount Technology Association (SMTA)

Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2

Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,

Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2

Surface Mount Technology Association (SMTA)

Career Center - Resumes: reflow cold spots (6)

mehrdad resume

Career Center | la jolla, California USA | Engineering

More than 18 years experience in AOI. Refer to my resume for more details.

Jr. Technical Asst/Failure Analysis Technician

Career Center | Nariveles, Philippines | 2019-11-21 13:32:04.0

Failure Analysis Technician Quality-driven and goal-focused with strong research, planning and Problem-solving abilities. Gifted in being a technical knowledge base, Organizing workflow and improving processes.

Express Newsletter: reflow cold spots (915)

SMTnet Express - May 9, 2019

SMTnet Express, May 9, 2019, Subscribers: 31,902, Companies: 10,760, Users: 26,083 Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material Credits: iNEMI (International Electronics

Partner Websites: reflow cold spots (211)

800531 - Altered Cold Plate

Heller Industries Inc. | https://hellerindustries.com/parts/800531/

800531 - Altered Cold Plate Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New

Heller Industries Inc.

KIC X5 Thermal Profiler With SPC Software And RF Capability For Reflow

KingFei SMT Tech | http://www.smtspare-parts.com/sale-11140440-kic-x5-thermal-profiler-with-spc-software-and-rf-capability-for-reflow.html

. Extensive testing revealed substantial benefits in setting up profiles in 1°C increments. Slight setpoint changes in the soak and reflow zones produced more robust profiles that reduced temperatures at hot spots on the board and provided more even heating across the assembly

KingFei SMT Tech


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