With twenty years of producing experiences, Hsin Lien Sheng Machinery Co., Ltd. is specialized in manufacturing Hydraulic presses, Hydraulic presses, Hydraulic Press, Die Spotting Press.
Industry Directory | Manufacturer / Other
Lien Chieh Machinery (LCM) established in 1947, specialized in manufacturing various kinds of hydraulic presses, inclusive of hydraulic die tryout press, hydraulic hemming press, etc.
- Flexible uses for all different kinds of Components like SMD, BGA, CBGA, CCGA, CSP, QFN, MLF, PGA and All Epoxy undefiled BGA .. etc . - Recommended for reworking All Plastic parts, PTH, Sockets, Connectors and Metal Shields . - Complete reworking
With 8/10/12 controlled upper and lower Microjet heating zones,the Microjet-N8/N10/N12 Series SMT reflow ovens, with thermal accuracy of ±1˚C, Patent design with micro nozzles spray hot air and with holes around nozzle to take hot air back, so to mak
Electronics Forum | Mon May 13 03:01:23 EDT 2019 | peterchan
Hello, sir. We are a SMT equipment manufacturer from China. We have a hot-press soldering machine that can change your current situation of manual soldering on PCB board. In addition, we have a better reflow oven, the upper and lower two cold tempe
Electronics Forum | Tue Jul 28 17:23:58 EDT 1998 | Robert Steltman
| | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | | First some details: | | PCB & Device: | | ============= | | 1) 16 layer (4 power, 4 gnd, 8 signal) | | 2) gold on nickel finish | | 3) ceramic
Used SMT Equipment | In-Circuit Testers
The most affordable, feature rich infrared camera available! The new FLIR T400 is the most affordable feature rich infrared camera available! The T400 now has FLIR FUSION! FLIR's new FUSION functionality allows for easier identification and interpre
Used SMT Equipment | Soldering - Reflow
The SMRO-4000 Scirocco Reflow oven has been developed for reflow soldering of Hybrid boards, SMT boards and Curing Glue or thin film pastes. The machine is developed for medium to large series of assembly. The Scirocco is based on hot air convection.
Industry News | 2010-09-02 16:09:40.0
Each step in the electronics assembly process will be on display and fully functioning on the show floor at Electronics Midwest, produced by IPC — Association Connecting Electronics Industries® and Canon Communications.
Industry News | 2018-10-18 08:36:26.0
How the modern solder reflow oven works?
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
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Parts & Supplies | Pick and Place/Feeders
> www.greensmt.com JUKI E9572729CA0 LA (L) CABLE ASM. SHENZHEN GREEN TECHNOLOGY CO.,LTD JUKI E95737290A0 MTC I/F(L) CABLE ASM. www.greensmt.com JUKI E95738550A0 DISPESE SV ASM SHENZHEN GREEN TECHNOLOGY CO.,LTD JUKI E95747210A0 BAD MARK SENSOR CAB
Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si
Career Center | la jolla, California USA | Engineering
More than 18 years experience in AOI. Refer to my resume for more details.
SMTnet Express, May 9, 2019, Subscribers: 31,902, Companies: 10,760, Users: 26,083 Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material Credits: iNEMI (International Electronics
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/gluing-hot-melt-adhesive?con=t&page=28
adhesives and sealants. Rhino, VersaPail, DuraDrum, AltaPail, and others... Soldering Nordson Corporation Hot Bar Reflow Soldering is a selective soldering process where two pre-fluxed, solder coated parts are heated with a heating element
KingFei SMT Tech | http://www.smtspare-parts.com/sale-11140440-kic-x5-thermal-profiler-with-spc-software-and-rf-capability-for-reflow.html
. Extensive testing revealed substantial benefits in setting up profiles in 1°C increments. Slight setpoint changes in the soak and reflow zones produced more robust profiles that reduced temperatures at hot spots on the board and provided more even heating across the assembly
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