Industry Directory | Association / Non-Profit / Events Organizer / Training Provider
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Industry Directory | Manufacturer
Datapaq, founded in 1984, is the world leader in temperature profiling. Datapaq systems provide key information on the effectiveness of heat processing in the electronics assembly industry, using the most advanced and tested techniques.
Heller 1707 MK7 SMT Reflow Oven 7 Heating ZonesMax PCB Width: 56cmWeight: 1450KGDimension: 360x152x144cmProduct description: Heller 1707 MK7 SMT Reflow Oven, 7 Heating Zones, Max PCB Width: 56cm, Weight: 1450KG, Dimension: 360x152x144cm Heller
10 Zones Economical SMT Reflow Oven KTE-1000 Heating:10 heating zones Cooling zones: top 2 Weigth: APPROX 2615KG Dimension: 6135*1360*1490mm Product description: 10 Zones Economical SMT Reflow Oven KTE-1000, Heating:10 heating zones, Cooling z
Electronics Forum | Tue Sep 09 12:05:44 EDT 2008 | tonyamenson
First and fore most is to find your paste manufacturer spec sheets. Read it over several times and let it all sink in. Then call them with questions as they want to keep your business so their engineers want to help you use their product. I assume y
Electronics Forum | Wed Sep 15 10:55:21 EDT 1999 | Scott S. Snider
| Hi, | | Can someone pls suggest to me the best reflow temperature setting | for a force air convection oven. The details is as follow. | 1) Heller 1700s | 2) 12 zone---6 top and 6 bot | 3) Solder paste --- Qualitek 691 non clean | 4) board size :
Used SMT Equipment | Soldering - Reflow
Heller REFLOW OVEN MK3 2013 Condition: 2013 USED Standard type Feel free to contact me if interested!! Availability: Available on backorder The 1800 models support high mix / high volume throughput… at speeds up to 32 inches (80 centimeters) per min
Used SMT Equipment | Soldering - Reflow
Still running production unit new unit delivered before the end of the year. The Heller 1809 MK5 is a reflow soldering system used in electronics manufacturing. Here are some key specifications and features: Model: 1809 MK5 Heating Zones: 9 Zones
Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
Industry News | 2018-10-18 08:42:00.0
Reflow oven zone temperature set up and thermal profile
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Parts & Supplies | Soldering - Reflow
Brand New SMT2010 TABLE-TOP REFLOW OVEN LEAD-FREE Description: This is a brand new, SMT2010 Reflow oven. More and more surface mount devices (SMD) are used on electronic circuit boards. Large floor model reflow ovens are expensive and heavy, no
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2010-04-29 21:40:37.0
The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Career Center | Bangalore, India | Engineering,Management,Production,Quality Control,Technical Support
WORK EXPERIENCE DETAILS: 7+ Years of Experience in manufacturing & hardware testing of Protocol conveter & Commissioning, Products delivery and QA/QC. 2+ Years of Experience in Hardware testing and Package Level testing. 2+ Years of Experience in
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM
Heller Industries Inc. | https://hellerindustries.com/bit_publications/repeatabilitity-of-the-temperature-profile-under-load-variation/
Repeatabilitity of the Temperature Profile Under Load Variation - Heller Industries Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
KingFei SMT Tech | http://www.smtspare-parts.com/sale-11936272-kic-start-thermal-profile-smt-thermal-profilling-image-reflow-profile-9-6-channel-tester.html
KIC START Thermal Profile , SMT Thermal Profilling Image Reflow Profile 9 6 Channel Tester Leave a Message We will call you back soon
