Industry Directory: reliability (609)

Nordson Electronics Solutions

Nordson Electronics Solutions

Industry Directory | Manufacturer

Nordson Electronics Solutions makes reliable electronics an everyday reality. Our ASYMTEK, MARCH, and SELECT brands deliver precision fluid dispensing, conformal coating, plasma treatment and selective soldering equipment.

Heller Thermal Systems

Heller Thermal Systems

Industry Directory | Manufacturer

Heller Thermal Systems India location featuring reflow soldering ovens and pressure curing ovens.

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New SMT Equipment: reliability (955)

SMT Dispensing Pumps for Integration

SMT Dispensing Pumps for Integration

New Equipment | Dispensing

Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti

GPD Global

Jetting Pump - NCM5000

Jetting Pump - NCM5000

New Equipment | Dispensing

Jetting Simplified Jetting pumps are excellent for dispensing small volumes of fluid at high rates of speed. The NCM5000 simplifies jetting to its basic elements - this means easy set up, cleaning, and maintenance for you. The drive system is design

GPD Global

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Electronics Forum: reliability (2418)

TO99 age and reliability

Electronics Forum | Thu Jan 25 13:57:48 EST 2001 | davef

Interesting. I'd start with the "Help Desk" at the Reliability Analysis Center [http://rac.iitri.org/]. Please get back with your findings.

BGA rework and reliability

Electronics Forum | Thu Oct 22 11:11:58 EDT 1998 | Hon

Dear all, What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rework on

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Used SMT Equipment: reliability (342)

Yamaha KS-6004-S Portable conveyor KINGSUN

Yamaha KS-6004-S Portable conveyor KINGSUN

Used SMT Equipment | SMT Equipment

Model No:KS-6004-S Portable conveyor Cycle time:Approx 15seconds  Power supply:100-230V AC (customized), single phase  Power load:Max 150V/A Air pressure: 4-6 bar Air volume:MAX 10L/minute Transport height:900±20mm (or customized) Transport di

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Samsung DECN-L2 chip mounter

Samsung DECN-L2 chip mounter

Used SMT Equipment | Flexible Mounters

Product Name: Samsung DECN-L2 chip mounter Product number: Samsung DECN-L2 Detailed product introduction By using Vision Head 12Flying to achieve the highest speed 82000CPH Through the flight identification method, the placement of the head movin

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

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Industry News: reliability (4812)

Heller expands Asian sales organization

Industry News | 2007-11-01 20:00:20.0

October 31, 2007, Florham Park, New Jersey � In continuation with its overall growth strategy, Heller Industries is pleased to announce the appointment of Mr. Wojtek Antoniak as Regional Sales Manager, Southeast Asia. Mr. Antoniak will be based in Singapore and will be responsible for sales management throughout Malaysia, Thailand, Vietnam as well as Singapore and the Philippines.

Heller Industries Inc.

Lean Stream & Heller Reflow Technology to Partner in CA & NV

Industry News | 2015-11-12 22:03:28.0

Heller Industries is thrilled to announce that we've partnered with the #1 Northern California Sales Representative Group - Lean-Stream!

Heller Industries Inc.

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Parts & Supplies: reliability (1207)

Sanyo stick feeder

Sanyo stick feeder

Parts & Supplies | Pick and Place/Feeders

SANYO stick feeder GSF-R01 SANYO 5000 Stick Feeder The operation rate of the machine is improved by the ability of stick feeder to operate continuously over an extended period. Unlike traditional stick feeders that rapidly vibrate u

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Universal Instruments GSF-R09 UNIVERSAL Stick Feeder

Universal Instruments GSF-R09 UNIVERSAL Stick Feeder

Parts & Supplies | Pick and Place/Feeders

GSF-R09 UNIVERSAL Stick Feeder GSF-R09 UNIVERSAL Stick Feeder The operation rate of the machine is improved by the ability of stick feeder to operate continuously over an extended period. Unlike traditional stick feeders that rapidly vi

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

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Technical Library: reliability (330)

THE EFFECT OF VACUUM REFLOW PROCESSING ON SOLDER JOINT VOIDING AND THERMAL FATIGUE RELIABILITY

Technical Library | 2023-01-17 17:19:44.0

A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.

Heller Industries Inc.

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Technical Library | 2023-01-17 17:12:33.0

Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.

Heller Industries Inc.

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Videos: reliability (1156)

No drip or drool across a wide range of fluid viscosities (low-to-mid and low-to-high) with GPD Global PCD Pumps for total control of your dispensing fluids.

No drip or drool across a wide range of fluid viscosities (low-to-mid and low-to-high) with GPD Global PCD Pumps for total control of your dispensing fluids.

Videos

http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to

GPD Global

Cost Effective Solution for Conformal Coating

Cost Effective Solution for Conformal Coating

Videos

Cost-effective Solutions for Conformal Coating New cost-effective, automated Conformal Coating System (SimpleCoat TR) with tilt and rotate capability and excellent repeatability for just under $48,000.  SimpleCoat basic model without tilt and rotate

GPD Global

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Training Courses: reliability (375)

IPC-7711/7721 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-7711/7721 Specialist (CIS)

The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.

Blackfox Training Institute, LLC

IPC-7711/7721 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-7711/7721 Trainer (CIT)

The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.

Blackfox Training Institute, LLC

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Events Calendar: reliability (121)

IPC High Reliability Forum

Events Calendar | Tue May 12 00:00:00 EDT 2020 - Thu May 14 00:00:00 EDT 2020 | Baltimore, Maryland USA

IPC High Reliability Forum

Association Connecting Electronics Industries (IPC)

Silicon Valley Chapter Webinar: Electronics Reliability for Autonomous Vehicles

Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,

Silicon Valley Chapter Webinar: Electronics Reliability for Autonomous Vehicles

Surface Mount Technology Association (SMTA)

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Career Center - Jobs: reliability (108)

Product Reliability Engineering Manager

Career Center | San Jose, Nationwide | Engineering,Management

This world-renowned $13B organization is seeking a Product Reliability Engineering Manager (to report directly into the VP) for our San Jose, CA corporate technology office. We prefer candidates in the Silicon Valley area, but will consider candidat

The Engineering Connection

Staff Reliability Engineer

Career Center | Austin, Texas USA | Engineering

KN Research is assisting it's award-winning high-tech client to fill a Staff Reliability Engineer position. We are seeking an experienced Reliability Engineer with strong skills in hands-on product failure analysis, field failure and internal failur

KN Research

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Career Center - Resumes: reliability (32)

resume_srini_chada

Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support

• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a

BankeemChheda-Resume

Career Center | Rochester, New York USA | Engineering

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research

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Express Newsletter: reliability (572)

Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes

Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes by: Cheryl Tulkoff, Greg

Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes

Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Leadless, near chip scale

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reliability searches for Companies, Equipment, Machines, Suppliers & Information

Win Source Online Electronic parts

Software for SMT placement & AOI - Free Download.
Gordon Brothers October 2-30, 2024 Auction

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Electronics Equipment Consignment

Reflow Soldering 101 Training Course
Hot selling SMT spare parts and professional SMT machine solutions

Reflow Soldering Oven & Pressure Curing Oven Manufacturer in India