FUJI CYLINDER/SHAFT/SILENCER/GUIDE FUJI IPH4540 NOZZLE ASSY 20,0 XL Z-AXIS FUJI IPH4541 NOZZLE - LL IP / IP2 PICK UP NOZZLE IP / IP2 PIC FUJI IPH4610 DISPERSION SHEET 4,0/7,0/10,0 FUJI IPH4620 DISPERSION SHEET 2,5 FUJI IPH5030 BRACKET FUJI IPH5270 B
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
Electronics Forum | Fri Oct 29 23:08:06 EDT 2010 | laen
What software are people using to compute route and retain tabs on panels? I produce some complicated (150 board, 80+ different design) panels, and I haven't found a good way to programmatically compute where to place the tabs. Thanks.
Electronics Forum | Thu Feb 17 15:00:25 EST 2005 | austinj
I am working on fixturing to keep the pcb/panel from "floating" in the oven. The problem is cold solder/non-wetting on all components. My thoughts lean towards the thin pcb not retaining the "preheat temps" for proper soak/reflow. Any thoughts about
Used SMT Equipment | Pick and Place/Feeders
FUJI CP 643 machine Condition：refurbished Year: 2000 or 2000+ ... Made in Japan Others Fuji Spare parts: S2115M CYLINDER, AIR H5283A BOLT HEX SOCKET W1021A WASHER, LOCK A4067H ELBOW PB73210 BKT, RETAINER N1077H NUT HEX N1076A N
Used SMT Equipment | Chipshooters / Chip Mounters
NXT IIIC has the same features of the NXT III but in a smaller footprint. This allows you to maximize production in a restricted floorspace environment.Fuji Scalable Placement Platform. The best floorspace productivity in the industry. One NXT IIIc m
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Industry News | 2003-03-19 08:55:51.0
The parties have agreed not to disclose the transaction price.
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Parts & Supplies | Pick and Place/Feeders
Part Name：RETAINER (CP6/CP7) Part No：LPC0023,KJAC0091
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Technical Library | 2020-08-16 14:50:25.0
Not all desiccant bags are created or perform equally. Performance measures include: a) How long does desiccant last? b) How much are can be desiccated in a given area? c) How much moisture is retained, and or released back into the atmosphere? This article walks engineers through various test they can perform to determine efficacy. Additionally, the article highlight between adsorption vs adsorption.
Technical Library | 2020-09-23 21:37:25.0
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which has a melting point of about 139°C. Experience so far indicates that such Bi-Sn alloys do not have the mechanical properties and microstructural stability necessary to deliver the reliability required for the mounting of BGA packages. Options for improving mechanical properties with alloying additions that do not also push the process temperature back over 200°C are limited. An alternative approach that maintains a low process temperature is to form a hybrid joint with a conventional solder ball reflowed with a Bi-Sn alloy paste. During reflow there is mixing of the ball and paste alloys but it has been found that to achieve the best reliability a proportion of the ball alloy has to be retained in the joint, particular in the part of the joint that is subjected to maximum shear stress in service, which is usually the area near the component side. The challenge is then to find a reproducible method for controlling the fraction of the joint thickness that remains as the original solder ball alloy. Empirical evidence indicates that for a particular combination of ball and paste alloys and reflow temperature the extent to which the ball alloy is consumed by mixing with the paste alloy is dependent on the volume of paste deposited on the pad. If this promising method of achieving lower process temperatures is to be implemented in mass production without compromising reliability it would be necessary to have a method of ensuring the optimum proportion of ball alloy left in the joint after reflow can be consistently maintained. In this paper the author explains how the volume of low melting point alloy paste that delivers the optimum proportion of retained ball alloy for a particular reflow temperature can be determined by reference to the phase diagrams of the ball and paste alloys. The example presented is based on the equilibrium phase diagram of the binary Bi-Sn system but the method could be applied to any combination of ball and paste alloys for which at least a partial phase diagram is available or could be easily determined.
00352430-01 PROX.SWITCH POSITION WIDTH ADJUST.CONV.2 00352431-01 CABLE MOTOR INPUT BELT TRANSPORT 2 00352432-01 CABLE MOTOR PLACEMENT AREA 4 00352433-01 CABLE MOTOR INTERMEDIATE BELT TRANSPORT 2 00352434-01 CABLE MOTOR PLACEMENT AREA 3 00352435-
00372400-01 SOFTWARE SIPLACE ADDED LANGUAGE SC 504/1 00372426-01 COMMUNICATION UNIT KSP-COM351A 00372446-01 COMMUNICATION UNIT KSP-COM352A 00372500-04 Software SIPLACE Station 504/4-504.02SP2 00372544-01 Retrofit Kit for SIPLACE 24/32mm feeder fo
Training Courses | ONLINE | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Mon Nov 25 00:00:00 EST 2019 - Mon Nov 25 00:00:00 EST 2019 | ,
Webinar: Overcoming Challenging X-Ray Problems
Career Center | , | 2001-05-17 22:28:23.0
Myers & Associates has been retained to identify an executive to manage a large, multi-site contract manufacturing operation. Prior experience in SMT contract manufacturing required. P&L experience required.
Career Center | , USA | Human Resources
StepBeyond.com is coming! We are looking for independent agents who want to grow their own business under the StepBeyond.com model. There is NO comparable model to what StepBeyond.com does. We are looking for talented, ethical people. Ethical: Op
Career Center | Port Harcourt, Argentina | Management
Hold strong background in electronic repairs
Career Center | Thanjavur, India | Production,Quality Control,Technical Support
work in one year and above Quality engineer in sanmina,current work in SMT Technical engineer in coimbatore
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/efd-products/optimum-cartridge-retainer-systems
Optimum® Cartridge Retainer Systems | Clear Cartridge Retainer System | Nordson EFD Search Arrow Black Arrow Right Arrow Youtube Twitter Facebook Paper Plane LinkedIn Zoom In Grid Envelope Earth Download File - Document 9 Boxes Browser Calendar Chart Click Icon Close
Heller Industries Inc. | https://hellerindustries.com/parts/5431k/
5431K - RETAINER,SSCAPTIVE SCREW17-6-1 Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
