Electronics Forum: sac105 melting (3)

BGA Bump Alloys

Electronics Forum | Wed Nov 08 10:48:34 EST 2023 | processman

Hi Was wondering what the general take is with reflow profiles to take into account differing solder paste alloy compared to the solder alloy used for the bumps of a bga device. For instance, SAC305 solder paste and BGA device with SAC105 (higher m

SAC105 vs. SAC305

Electronics Forum | Thu Sep 18 12:11:45 EDT 2008 | jwentz

Does anyone have experience with using Pb-free SAC105? We are looking at the pro's/con's compared to a SAC305 process for a SMT operation. I have read it has a higher melting temperature. Specifically, we are concerned about a product we are developi

Industry News: sac105 melting (1)

Balver Zinn to Demonstrate New i-SAC Series of Optimized Solder at Productronica 2009

Industry News | 2009-12-07 17:55:23.0

BALVE, GERMANY — November 2009 — The BALVER ZINN Group, a leading provider of high-quality alloyed solder anodes, as well as special cored and solid wires, will demonstrate the new i-SAC series of optimized Alloyed Lead-Free Solders in Hall A4, Stand 570 of the upcoming Productronica exhibition - scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.

Balver Zinn

Express Newsletter: sac105 melting (39)

SMTnet Express July 18 - 2013, Subscribers: 26169

SMTnet Express July 18, 2013, Subscribers: 26169, Members: Companies: 13430, Users: 34947 Effect of Surface Oxide on the Melting Behavior of Lead-Free Solder Nanowires and Nanorods by Fan Gao, Karunaharan Rajathurai, Qingzhou Cui, Guangwen Zhou


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