Industry Directory | Consultant / Service Provider
Performance 2000 develops and implements solutions that improve sales, marketing and channels (supply-chain) performance with ASP services, software applications and consulting that address Lead Management, Forecasting, CRM, Sales Force Automation, Marketing Management and Channels Management.
Industry Directory | Distributor / Manufacturer
Lorlin manufactures discrete semiconductor component test systems for small signal and power devices. 50 years in business, over 3000 installations. SMD devices: transistors, Fets, diodes, scrs, triacs, optos, and many others.
Ersa HOTFLOW 4/14 Reflow Oven Working width: 45-560 mmProcess length: 4,400 mmHeated length: 2,665 mmCooling length: 1,735 mmWeight appr. 2,000 kgdimension: 5,030x1,410x1,350 mm Ersa HOTFLOW 4/14 Reflow Oven Ersa HOTFLOW 4/14 Reflow Oven Refl
New Equipment | Assembly Services
JUKI RS-1XL SMT Assembly Line JUKI RS-1XLSMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 29000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place machi
Electronics Forum | Tue Jul 23 07:55:24 EDT 2019 | ashray
how can I change the language in MPM up 2000? the machine has a default language set to german I wanted to know if it can be changed to English. I tried in BIOS there is no option to do that. Please guide me on this.
Electronics Forum | Thu Jul 25 09:56:39 EDT 2019 | ashray
how can I change the language in MPM up 2000? the machine has a default language set to german I wanted to know if it can be changed to English. I tried in BIOS there is no option to do that. Please guide me on this.
Used SMT Equipment | Screen Printers
MPM UP2000HiE PRINTER Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps) Thickness rang
Used SMT Equipment | Pick and Place/Feeders
JUKI FX-3 High Speed Modular Mounter Model FX-3 FX-1R(Conventional model kind) Placement speed (chip) Optimum 0.049Sec./chip(74,000CPH) 33,000CPH*2 （optimum condition） IPC9850 60,000 CPH 25,000 CPH Component size 0402(01005) ～□33.5mm (or dia
Industry News | 2003-04-29 08:27:33.0
Emerson Energy Systems is using Weidmuller's Minimate S2L/B2L PCB connector for its IMT 2000 multifunction unit, thanks to its space saving design and competitive price.
Industry News | 2003-06-20 08:54:22.0
Service Pack 1 for P-CAD 2002 released today
 of MPM CA-3721.jpg)
Parts & Supplies | Screen Printers
Product Name: P7673; MPM camera video cable Part Number: P7673; CA-372; Cable; Adapter Description: MPM camera video cable P7673; CA-372; P7673 CABLE, CAMERA ADAPTER Applicable models: AP UP Printing Presses MPM camera video cable P7673;
 of MPM CA-3722.jpg)
Parts & Supplies | SMT Equipment
Product Name: P7673; MPM camera video cable Part Number: P7673; CA-372; Cable; Adapter Description: MPM camera video cable P7673; CA-372; P7673 CABLE, CAMERA ADAPTER Applicable models: AP UP Printing Presses MPM camera video cable P7673;
Technical Library | 2023-11-25 07:46:13.0
In the dynamic realm of Surface Mount Technology (SMT), where efficiency and precision are paramount, I.C.T, a renowned SMT equipment manufacturer, proudly unveils its latest innovation – the I.C.T-910 Automatic IC Programming System. Crafted to cater to the intricate demands of SMD chip programming, this cutting-edge device vows to redefine your programming experience and elevate production capabilities. Programming system.png The Power of IC Programming System: As a beacon of excellence in IC Programming Systems, the I.C.T-910 seamlessly integrates advanced technology with user-friendly features. This system empowers manufacturers in the SMT industry, offering versatility in programming needs by accommodating a wide range of SMD chips. Precision Programming: The I.C.T-910 boasts unparalleled precision in programming SMD chips, ensuring accuracy in every generated code. In the SMT industry, where even the slightest error can lead to setbacks, this precision is indispensable. Efficiency Redefined: Accelerate your production timelines with the I.C.T-910's efficient programming capabilities. Engineered to optimize workflows, this system ensures rapid programming without compromising quality, recognizing that time is money in the SMT industry. User-Friendly Interface: Navigating the complexities of IC programming is simplified with the I.C.T-910's intuitive user interface. Operators, even without extensive programming expertise, can harness the system's power, minimizing the learning curve and maximizing productivity. Compatibility and Adaptability: The I.C.T-910 breaks free from limitations, supporting a wide array of SMD chip models. It is a versatile solution for diverse programming requirements, allowing you to stay ahead of technological advancements. Why Choose I.C.T-910 IC Programming System? 8 sets of 32-64sit burners Nozzle: 4pcs Camera: 2pcs (Component camera + Marking camera) UPH: 2000-3000PCS/H Package type: PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, BGA, CSP, SCSP, and so on. Compatibility: Adapters provided based on customer products. Simple operation interface: Modular and layered interface with pictures and texts for easy operation. System upgrade: Free software upgrade service. Reliability: Trust in the I.C.T-910, a programming system that prioritizes reliability. Rigorous testing ensures consistent and dependable performance, reducing the risk of programming errors and downtime. Elevate Your Competitiveness: Incorporate the I.C.T-910 into your production line to elevate competitiveness in the market. Stay ahead with a programming system designed to meet the demands of the fast-paced SMT industry. Embrace the Future with I.C.T-910: In a landscape where precision, efficiency, and adaptability are non-negotiable, the I.C.T-910 Automatic IC Programming System emerges as the game-changer for SMT manufacturers. Revolutionize your programming processes, enhance productivity, and future-proof your operations with the I.C.T-910. Choose I.C.T-910 and stay ahead in the SMT industry, ushering in the next era of IC programming excellence.
Technical Library | 2019-09-24 15:41:53.0
This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications. The coatings consist of: Specialty (green transparent) liquid photoimageable solder masks (LPiSM) compatible with long-term thermal storage/stress in excess of 150°C. Combined with the appropriate high-temperature base material, and along with a suitable copper pre-treatment, these solder resists are capable of fulfilling higher thermal demands. In this context, long-term storage tests as well as temperature cycling tests were conducted. Moreover, the effect of various Cu pre-treatment methods on the adhesion of the solder masks was examined following 150, 175 and 200°C ageing processes. For this purpose, test panels were conditioned for 2000 hours at the respective temperatures and were submitted to a cross-cut test every 500 h. Within this test set-up, it was found that a multi-level chemical pre-treatment gives significantly better adhesion results, in particular at 175°C and 200°C, compared with a pre-treatment by brush or pumice brush. Also, breakdown voltage as well as tracking resistance were investigated. For an application in LED technology, the light reflectivity and white colour stability of the printed circuit board are of major importance, especially when high-power LEDs are used which can generate larger amounts of heat. For this reason, a very high coverage power and an intense white colour with high reflectivity values are essential for white solder masks. These "ultra-white" and largely non-yellowing LPiSM need to be able to withstand specific thermal loads, especially in combination with high-power LED lighting applications. The topic of thermal performance of coatings for electronics will also be discussed in view of printed heatsink paste (HSP) and thermal interface paste (TIP) coatings which are used for a growing number of applications. They are processed at the printed circuit board manufacturing level for thermal-coupling and heat-spreading purposes in various thermal management-sensitive fields, especially in the automotive and LED lighting industries. Besides giving an overview of the principle functionality, it will be discussed what makes these ceramic-filled epoxy- or silicone-based materials special compared to using "thermal greases" and "thermal pads" for heat dissipation purposes.
FKN Systek K2000 - Reduce scrap due to board handling Issues Economical Manual and Motorized Depaneling of Pre-scored PCBs Blades Made of Long Lasting High Speed Steel.. Singulate Panels with Components up to 2.5" Adjustable front blade guard
FKN Systek K1000 - Economical Manual and Motorized Depaneling of Pre-scored PCBs Blades Made of Long Lasting High Speed Steel.. Singulate Panels with Components up to 2.5" Adjustable front blade guard for correct scoreline input. Optional Work
Events Calendar | Thu Apr 28 00:00:00 EDT 2022 - Thu Apr 28 00:00:00 EDT 2022 | ,
Joint Silicon Valley/Ohio Valley Chapter Webinar: Automation & the Journey to the Smart Factory
Events Calendar | Tue Jun 11 00:00:00 EDT 2024 - Tue Jun 11 00:00:00 EDT 2024 | Uniontown, Ohio USA
7th Annual Ohio Valley Chapter Member Appreciation Golf Outing
Career Center | Dallas, Texas USA | Engineering
Requirements: 3 plus years experience using Mixed Signal Test equipment. [ATE] This person should have experience writing test programs, with good debug skills. They should have experience with A/D converters. Company Car, lite travel, Lap Top comp
Career Center | Irvine, California USA | Engineering
Requirements: 3 plus years experience using Mixed Signal Test equipment. [ATE] This person should have experience writing test programs, with good debug skills. They should have experience with A/D converters. Company Car, lite travel, Lap Top comp
Career Center | Esala_Senavirathne, Sri Lanka | Engineering,Maintenance,Research and Development,Technical Support
I am having autonomous mechanical and electronics system design, maintenance, installation,.
Career Center | Muzzaffarnagar, India | Production
Complete programming of Pick & Place as per BOM. Working with both low & high Profile solder Paste, and Glue. Accurate Placement of all SMT Component like Chip, SOT, SOD, QFP, Tantalum Capacitor & etc. Familiar with the critical problem in process
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