Industry Directory | Manufacturer's Representative
Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi
New Equipment | Education/Training
This is a "real life" how to solder kit including both throughhole and SMT components. The board has ground planes that you would find in a real PCB assembly. Upon completion the sudents will have a working board. If you are trying to instruct new
Flake & Powders for die-Attach adhesives and thick film inks. (Silver, Copper, Silver-Palladium, Platinum)
Electronics Forum | Thu Apr 29 22:50:41 EDT 1999 | Kelly Morris
Tombstoning 0805s w/palladium/platinum/silver terminations We are experiencing tombstoning problems on 0805 packages that have paladium/platinum/silver terminations. It comes & goes...... I�ve checked the reflow profile, and paste deposition and a
Electronics Forum | Mon Mar 30 08:11:22 EST 1998 | Derek Drabenstadt
Does anyone have any experience with fired-silver/platinum/palladium lead terminations soldering. I have had issues on nickel over gold plated boards but not with HASL'd boards with tin/lead pads. Is this the norm?
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Industry News | 2003-04-10 10:27:46.0
IPC and JEDEC Send Out Call for Papers
Parts & Supplies | Assembly Accessories
1 EZA-192-114-4A POMP ASSY VACUUM 2 EZ1-492-203-11 VACUUM PUMP ASSY 3 EZ4-453-767-31 SHEET RUBBER 4 EZ4-454-742-01 SILENCER (ANA1-03) 5 EZ4-455-483-01 ELBOW (3/8) STREET 6 EZ7-600-037-59 TAPE SEAL(TOMBO NO.9082)13X15M 7 EZ7-683-435-04 BOLT HEXA
Parts & Supplies | Pick and Place/Feeders
TCI 8/97 PANA N20930 CONTROL BOARD -> TCI /97 PANA N20931 POWER BOARD -> TCI 8/97 PANA N20933 VR LED BOARD -> TCI 8/97 PANA N209361104 MAIN CPU CARD PANA N20948 MAIN CPU CARD PANA N20949 NC CARD (LA-M00205A) PANA N20959 MMI CARD LA-M00104D+..103E PAN
Technical Library | 2015-03-26 19:16:03.0
Nickel-palladium-gold-finished terminals are susceptible to creep corrosion. Excessive creep corrosion can result in device failure due to insulation resistance loss between adjacent terminals. The mixed flowing gas test has been demonstrated to produce creep corrosion on parts with nickel-palladium-gold finished terminals. Conformal coats are often used to protect printed wiring assemblies from failure due to moisture and corrosion. However, coating may not be sufficient to protect lead terminations from failure.In this study, acrylic, silicone, urethane, parylene, and atomic layer deposit (ALD) coatings were examined for their effectiveness at preventing corrosion of nickel-palladium-gold-finished terminals.
Technical Library | 2010-08-19 18:33:17.0
The silver end termination plays an important role for multilayer chip inductors. A basic requirement is to achieve excellent electrical properties with superior adhesion to the chip. Driven by the increasing price of silver, interest has been shown to
This is what the fully assembled How to Solder Kit looks like. Depress the button and one of the LEDs will remain lit at the end (it eventually times out). You can add some kind of template so each LED position has some meaning. The PCB has a real gr
This is what the fully assembled How to Solder Kit looks like. Depress the button and one of the LEDs will remain lit at the end (it eventually times out). You can add some kind of template so each LED position has some meaning. The PCB has a real gr
Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications The silver end termination plays an important role
SMTnet Express, March 26, 2015, Subscribers: 22,542, Members: Companies: 14,271 , Users: 37,963 Effectiveness of Conformal Coat to Prevent Corrosion of Nickel-palladium-gold-finished Terminals Michael Osterman; Center for Advanced Life Cycle
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
today’s lead-free soldering applications. A series of soldering dissolution experiments, modeled on Bader’s, were conducted using SAC305 solder with gold, silver, palladium, platinum, copper and nickel samples
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
Procured specially prepared components with no lead metalization. Either tin, palladium silver or nickel. ♦ For BGAs, removed tin/lead balls and re-balled with tin/silver balls. ♦
