Flake & Powders for die-Attach adhesives and thick film inks. (Silver, Copper, Silver-Palladium, Platinum)
Reel-to-reel plating; Wire bondable Gold, Silver, Copper, Nickel,...
Electronics Forum | Mon Oct 02 14:59:42 EDT 2023 | joeljacobo
Thank you!
Electronics Forum | Mon Oct 02 15:01:14 EDT 2023 | joeljacobo
Thank you Dave, I will check it out
Industry News | 2021-03-25 15:48:41.0
The SMTA Officer team is excited to provide our members with a new webinar by Dr. Nathan Blattau, R&D Fellow at Ansys, Inc., on "Next Generation Lead Free Solders for High Reliability and SMT Yield improvement in Client Computing Systems." The webinar will be on Tuesday, April 6th at 12:00 PM EST and will discuss the evolution of lead free (Pb-free) solder, from tin-silver-copper (SAC) system with silver content of 3.0 and 4.0 to low SAC solders and the emergence of high reliability Pb-free solder. It will cover the reasons and the driving forces of industries implementing this change.
Industry News | 2003-06-11 08:00:48.0
IPC has begun a comprehensive study of the three leading lead-free alloys (Tin-Silver-Copper) in an effort to analyze the properties of the leading candidates for lead-free assembly.
Parts & Supplies | General Purpose Equipment
The conductive elastomer have good conductive,and the products are mainly used in army electronic equipments like spaceflight,aviation,ect. We can produce this products according the drawing supplied by our customers. The materials: Silicon with Si
Technical Library | 2012-10-23 14:25:38.0
Tin-Silver-Copper alloys are the primary choice for lead-free SMT assembly. Although there are other options available such as alloys containing bismuth or indium and other elements, tin-silver-copper solders, also known as SAC alloys are by far the most popular. They are used by approximately 65% of users, as last surveyed by Soldertec in 2003.
Technical Library | 2008-01-03 17:50:51.0
Lead-free SMT can be achieved reliably if several process requirements are implemented carefully. Some of the variables to account for are listed below. The most common alloys used in lead-free SMT are tin-silver-copper alloys; these alloys all have a meting range between 217- 220°C. These alloys all melt at higher temperatures than traditional leaded solders such as the 63/37which has a melting point of 183 °C.
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Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
SMTnet Express, September 9, 2021, Subscribers: 26,718, Companies: 11,435, Users: 26,839 Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates Manganese can
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
– Tin Silver Vs. Tin Silver Copper Antimony • With .5% Antimony – Cold temperature stability is enhanced – Reduced Copper intermetallics
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
. 52In-48Sn has likewise been used as "lead-free" solder material in SMT applications. In-Sn is eutectic at 50.9In49.1Sn. In-Sn solder exhibits a substantially lower melting temperature. Tin-silver-copper
