Press fitting range: Coupling-Equal Coupling,Reducing coupling,Slip coupling, oupling with male/ female threads; Elbow-Elbow 90°,Elbow 45°, Reducing elbow,Elbow with plain end, Elbow with wall plate,
Industry Directory | Manufacturer
Shuttleworth Machinery Corporation was established May 21, 1962 by James J. Shuttleworth. The Shuttl
New Equipment | Rework & Repair Equipment
Pin Grid Array Extractors are available in two sizes and provide a quick and safe way to extract Pin Grid Array components from their sockets. All component sizes can be accommodated, as the tool is available in two or four grip models. Adjusting the
Slip-Trak� conveyors utilize Shuttleworth's Slip-Torque� principle in an innovative way. Slip-Trak� seals the Slip-Torque� drive components. Standard Slip-Trak� conveyors are suitable for up to Class 10 cleanrooms as well as other applications. Cle
Electronics Forum | Thu Apr 15 08:55:36 EDT 2004 | russ
It could be possible that you have some gears or the clutch is slipping when the oven gets warm.
Electronics Forum | Mon May 19 11:10:59 EDT 2008 | cyber_wolf
AJ. The mechanical clamping units on the xyz table are notorious for slipping on these machines.
Used SMT Equipment | Depanelizers / Routers
Key Features Solution for stress free depanelization Fixture-based highly efficient dust vacuum system Clean and precise depanelization for densely populated PCBs Advanced image-processing software offers point-and-click operation fo
Used SMT Equipment | Pick and Place/Feeders
Samsung SM411, Samsung SM411 Mounter, Second-hand Samsung SM411 Chip Shooter Equipment Profile: The SM411 uses the Samsung Patent On The Fly identification method and the double cantilever structure to achieve the chip component 42,000 CPH an
Industry News | 2003-06-02 09:14:01.0
Specification-Driven Circuit Design Environment Now Slashes Validation Time Up to 10x
Industry News | 2003-07-02 09:35:30.0
As a result, sales of optical MEMS, into segments other than telecommunications, are forecast to grow at a CAGR of 15.8% over the next five years.
Parts & Supplies | Pick and Place/Feeders
Cardboard box, slip lid f. 00335627-02
Parts & Supplies | Pick and Place/Feeders
Cardboard box, slip lid f. 00355752-01
Technical Library | 2018-11-06 12:42:25.0
Solder paste is a homogeneous, stable suspension of solder powder particles suspended in a flux binder, and is one of the most important process materials today in surface mount technology (SMT). By varying the solder particle size, distribution and shape, as well as the other constituent materials, the rheology and printing performance of solder pastes can be controlled. Paste flow behavior is very important in defining the printing performance of any paste.The purpose of this paper is to study the rheological behavior of SAC (Sn-Ag-Cu) solder paste used for surface mount applications in the electronic industry. The reason why the rheological tests are presented in this paper are two critical sub-processes: aperture filling and paste withdraw. In this paper, we report on the investigation of the rheological profiles, the serrated cone-to-plate system was found as effective in parameter minimizing the wall-slip effect
Technical Library | 2024-07-24 00:51:44.0
A blade server system (BSS) utilizes voltage regulator modules (VRMs), in the form of quad flat no-lead (QFN) devices, to provide power distribution to various components on the system board. Depending on the power requirements of the circuit, these VRMs can be mounted as single devices or banked together. In addition, the power density of the VRM can be high enough to warrant heat dissipation through the use of a heat sink. Typically, at field conditions (FCs), the BSS are powered on and off up to four times per day, with their ambient temperature cycling between 258C and 808C. This cyclical temperature gradient drives inelastic strain in the solder joints due to the coefficient of thermal expansion (CTE) mismatch between the QFN and the circuit card. In addition, the heat sink, coupled with the QFN and the circuit card, can induce additional inelastic solder joint strain, resulting in early solder joint fatigue failure. To understand the effect of the heat sink mounting, a FEM (finite element model of four QFNs mounted to a BSS circuit card was developed. The model was exercised to calculate the maximum strain energy in a critical joint due to cyclic strain, and the results were compared for a QFN with and without a heat sink. It was determined that the presence of the heat sink did contribute to higher strain energy and therefore could lead to earlier joint failure. Although the presence of the heat sink is required, careful design of the mounting should be employed to provide lateral slip, essentially decoupling the heat sink from the QFN joint strain. Details of the modeling and results, along with DIC (digital image correlation) measurements of heat sink lateral slip, are presented.
Manual V Cut PCB Depanelizer PCB Board Cutter It is widely used in modern rigid PCB industry. Manual V Cut PCB Depanelizer Machine Features: 1. Simple operation, speed is fast, to ensure that components of substrate are not injured by the move
1.5M LED board conveyor|PCB linking conveyor|PCB inspection station for SMT assemblyhttps://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/177.html ASCEN major for the PCB conveyor and the PCB magazine loader &unloader,PCB depaneling mac
Events Calendar | Thu Aug 15 00:00:00 EDT 2024 - Thu Aug 15 00:00:00 EDT 2024 | Duluth, Georgia USA
Atlanta Chapter In-Person Technical Meeting: State-of-the-Art Test Techniques
| http://etasmt.com/cc?ID=te_news_industry,26561&url=_print
% (when incorporated with reduced velocity). The nozzle simply slips onto the shaft and a groove on one side aligns to a pin on the collar
winsouce.jpg)
