Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
: A total of 21 of 40 test vehicles had a void greater than 45% of solder ball diameter or 20% of ball area Solder crack path typically found at solder joint / BGA package interface Via in Pad (VIP
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
- ray images in Figure 7a (192CABGA) and Figure 8a (84CTBGA) are typical of the extent and size of the solder voids. Note that the largest voids result in a noticeable increase in the diameter of the solidified solder spheres. Half of the population of
