Industry Directory | Manufacturer
Master Bond is a leading manufacturer of epoxy adhesives, sealants, coatings, potting and encapsulation compounds. Master Bond specializes in epoxies, silicones and uv curable polymer systems.
Industry Directory | Manufacturer / Other
ISO certified global manufacturer and supplier of light-curable adhesives, coatings, oligomers, dispense systems, light-curing equipment, and technical consulting for the industrial, medical, and electronics industries.
For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Electronics Forum | Thu Feb 22 09:56:21 EST 2001 | blnorman
An adhesive, is an adhesive, is an adhesive. Yes most will thin when exposed to elevated temperature, but that's only for a short time. As cross-linking starts, viscosity increases. Having made countless numbers of adhesively bonded samples in the
Electronics Forum | Mon Aug 02 11:21:29 EDT 2004 | sforman1
Use MicroCoat Technologies UV cure solder mask. will leave PCB absolutely clean. used in many PCB solder/wirebonding apps. http://www.m-coat.com
Industry News | 2024-04-09 11:59:08.0
Choosing the optimal equipment for your PCB coating line is pivotal for operational success. This guide navigates through the integral components of a standard PCBA coating machine line and their efficacy in addressing common challenges. We delve into the composition of the line, encompassing the elevator, transfer station, coating machine, inspection station, curing oven, and the cohesive system facilitated by a return conveyor.
Industry News | 2019-09-18 16:29:29.0
Nordson DAGE is delighted to announce its success in joining a group of leading UK companies, including Williams Manufacturing Group and Unipart, to advance the UK’s low-carbon automotive capabilities. As part of the UK government’s Industrial Strategy, five projects totaling £33M were awarded through the Advanced Propulsion Centre (APC).
Parts & Supplies | Pick and Place/Feeders
SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair 1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Technical Library | 2023-09-07 14:54:10.0
A global manufacturer of a broad line of electronic interconnect solutions worked with us to dispense conductive adhesive EpoTek H20E-FC. EpoTek H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. The primary goal was filling a rectangular cavity on a connector. The epoxy needed to fill the connector to the top of the walls in less than three seconds.
Technical Library | 2020-02-14 14:43:21.0
To meet the steady increase in technical requirements for electronic components, potting media properties must be extremely precise. Rheology, viscosity, filler content and curing behavior are only a few of the factors that play a role in their practical use. However, the growing complexity of materials often negatively impacts the ability to process or dispense them. In this case, material preparation and feeding systems specially designed for this purpose are required. These systems optimally prepare the material for the actual application and ensure homogeneous feeding to the dispensing system.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Events Calendar | Tue Jun 04 00:00:00 EDT 2019 - Tue Jun 04 00:00:00 EDT 2019 | Philadelphia, Pennsylvania USA
Quality Adhesive Technologies from LOCTITE - Free Workshop
Events Calendar | Tue Jun 28 00:00:00 EDT 2022 - Thu Jun 30 00:00:00 EDT 2022 | Novi, Michigan USA
Adhesives & Bonding Expo
